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Titanium Tungsten Evaporation Materials

VD0654 Titanium Tungsten Evaporation Materials, Ti/W

Catalog No.VD0654
MaterialTitanium Tungsten (Ti/W)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier producer and distributor of high-purity titanium and tungsten evaporation materials, as well as a diverse range of other evaporation products. We supply these materials in both powder and granule forms, and we can also provide custom formulations tailored to your specific needs upon request.

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Titanium Tungsten Evaporation Materials

TFM offers high-purity titanium tungsten evaporation materials, an alloy composed of titanium (Ti) and tungsten (W). These materials are crucial in various deposition processes to ensure the production of high-quality films. Our titanium tungsten evaporation materials boast a purity level of up to 99.9995%, achieved through rigorous quality assurance procedures to ensure product reliability.

Related Products: Titanium Evaporation Materials, Tungsten Evaporation Materials

Applications of Titanium Tungsten Evaporation Materials

Our titanium tungsten evaporation materials are used in numerous applications, including:

  • Deposition processes such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics applications, including wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

We ensure that titanium tungsten evaporation materials are carefully tagged and labeled for easy identification and quality control. Our packaging is designed to prevent damage during storage and transportation.

Contact Us

As a leading manufacturer and supplier of high-purity titanium tungsten evaporation materials, TFM provides a range of forms including tablets, granules, rods, and wires. Customized shapes and quantities are available upon request. We also offer additional products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and inquiries about our materials, including those not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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