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Beryllium Oxide Evaporation Materials

VD0674 Beryllium Oxide Evaporation Materials, BeO

Catalog No.VD0674
MaterialBeryllium Oxide (BeO)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier producer and supplier of ultra-pure beryllium oxide evaporation materials, along with an extensive range of other evaporation materials. Our offerings include both powder and granule forms, and we also provide custom formulations to meet specific needs.

MSDS File

Beryllium Oxide Evaporation Materials Overview

TFM provides high-purity beryllium oxide evaporation materials with the chemical formula BeO. Our beryllium oxide materials are essential for high-quality deposition processes, ensuring superior film quality. With purity levels reaching up to 99.9995%, TFM employs stringent quality assurance measures to guarantee the reliability of our products.

Related Product: Oxide Ceramic Evaporation Materials

Applications of Beryllium Oxide Evaporation Materials

Our beryllium oxide evaporation materials are versatile and used in various applications:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our beryllium oxide evaporation materials are meticulously tagged and labeled to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Contact Us

TFM is a leading producer and supplier of high-purity beryllium oxide evaporation materials. We offer materials in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and information on materials not listed, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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