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VD0693 Indium Tin Oxide ITO Evaporation Materials

Material Type:Indium Tin Oxide
Symbol:In2O3/SnO2 90/10 wt %
Melting Point :1,800 °C
E-Beam Crucible Liner Material:Fabmate®, Graphite
Purity:99.9% ~ 99.99%
Shape:Powder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity indium tin oxide (ITO) evaporation materials, along with a broad range of other evaporation materials. We provide these materials in both powder and granule forms and can customize them to meet your specific requirements.

Indium Tin Oxide (ITO) Evaporation Materials Overview

Indium Tin Oxide (ITO) is a highly utilized compound in the thin film industry, known for its exceptional electrical conductivity and optical transparency. The 90/10 WT% composition of indium oxide (In₂O₃) and tin oxide (SnO₂) is particularly favored, with a melting point of approximately 1,800°C and a density of 7.14 g/cm³. ITO thin films are critical in developing sensors and serve as a glass coating in the automotive industry.

TFM offers high-purity ITO evaporation materials with up to 99.9995% purity. These materials are essential in deposition processes, ensuring the creation of high-quality films. TFM’s rigorous quality assurance processes guarantee product reliability and consistency.

Related Products: Indium Evaporation Materials, Tin Evaporation Materials

Indium Tin Oxide Evaporation Materials Specification

Material TypeIndium Tin Oxide
SymbolITO
Color/AppearancePale yellow to greenish-yellow
Melting Point1,800°C
Density7.14 g/m3
Purity99.5% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications of Indium Tin Oxide (ITO) Evaporation Materials

ITO evaporation materials are widely used in various high-tech applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Used in wear protection, decorative coatings, and display technologies.

Packaging and Handling

TFM ensures that all indium tin oxide evaporation materials are clearly tagged and labeled for efficient identification and strict quality control. Our packaging methods are designed to protect the materials from any damage during storage or transportation, ensuring they reach you in perfect condition.

Contact TFM

As a leading provider of high-purity indium tin oxide evaporation materials, TFM offers a variety of shapes, including tablets, granules, rods, and wires. We can also cater to custom specifications and quantities upon request. In addition, TFM supplies a wide range of related products, including evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and inquiries regarding our evaporation materials or other products, please feel free to contact us.

Ordering Table

Material Size Quantity Purity Part Number
Indium Tin Oxide 1/8" - 1/4" Pieces 1 lb. 99.99% EVMITO40
Indium Tin Oxide 1/8" - 1/4" Pieces 25 g 99.99% EVMITO40A
Indium Tin Oxide 1/8" - 1/4" Pieces 50 g 99.99% EVMITO40B
Indium Tin Oxide 1/8" - 1/4" Pieces 100 g 99.99% EVMITO40D
Indium Tin Oxide 1/8" - 1/4" Pieces 250 g 99.99% EVMITO40J
Indium Tin Oxide 1/8" - 1/4" Pieces 1 kg 99.99% EVMITO40KG
Indium Tin Oxide 1/8" - 1/4" Pieces 500 g 99.99% EVMITO40T

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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