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VD0731 Terbium(III,IV) Oxide Evaporation Materials, Tb4O7

Catalog No.VD0731
MaterialTerbium Oxide (Tb4O7)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM excels in manufacturing and supplying high-purity terbium(III,IV) oxide evaporation materials, along with a diverse range of other evaporation products. Our materials are available in both powder and granule forms, and we offer customized solutions to meet specific requirements. Whether you need standard or tailored options, TFM provides reliable and high-quality materials for your needs.

Terbium(III,IV) Oxide Evaporation Materials: Product Description

TFM provides high-purity terbium(III,IV) oxide evaporation materials, known chemically as Tb4O7. With a purity level reaching up to 99.9995%, these oxide materials are essential for ensuring high-quality deposition films. Our rigorous quality assurance processes guarantee that these materials deliver consistent and reliable performance.

Terbium(III,IV) Oxide Evaporation Materials: Specifications

  • Material Type: Terbium(III,IV) Oxide
  • Symbol: Tb4O7
  • Color/Appearance: Dark brown-black solid
  • Theoretical Density: 7.3 g/cm³
  • Purity: 99.9% ~ 99.99%
  • Shape: Available as powder, pellets, granules, or custom-made

Terbium(III,IV) Oxide Evaporation Materials: Applications

Our terbium(III,IV) oxide evaporation materials are versatile and used in various applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for applications such as wear protection, decorative coatings, and display technologies.

Terbium(III,IV) Oxide Evaporation Materials: Packaging

To maintain the integrity and quality of our products, TFM packages terbium(III,IV) oxide evaporation pellets in plastic vacuum bags. This packaging protects against damage during storage and transportation. Each package also includes a Certificate of Analysis (COA) for the raw material.

Contact TFM

TFM is dedicated to producing high-purity terbium(III,IV) oxide evaporation materials for use in semiconductor, CVD, PVD, and optical applications. Our engineering, manufacturing, and analytical teams work together to deliver industry-leading products. For more information or to discuss your specific needs, please get in touch with us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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