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Tantalum Nitride Evaporation Materials

VD0755 Tantalum Nitride Evaporation Materials, TaN

Catalog No.VD0755
MaterialTantalum Nitride (TaN)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier of high-purity Tantalum Nitride evaporation materials. We offer these materials in both powder and granule forms, with customization options available to meet specific needs. Whether you require standard or tailored solutions, TFM is committed to delivering quality and reliability in all our evaporation materials.

MSDS File

TFM: Premium Tantalum Nitride Evaporation Materials

Tantalum Nitride evaporation materials from TFM are high-performance nitride ceramic compounds with the chemical formula TaN. These materials, with purity levels up to 99.9995%, are essential in achieving superior quality in deposition processes. TFM’s stringent quality assurance procedures ensure that every batch meets the highest standards of reliability and performance.

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Specifications for Tantalum Nitride Evaporation Materials

Material TypeTantalum Nitride
SymbolTaN
Appearance/ColorBlack Solid
Melting Point3,090 °C
Density14.3 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Tantalum Nitride Evaporation Materials

These Tantalum Nitride materials are versatile and used in:

  • Deposition Processes: Crucial for semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD).
  • Optics: Ideal for wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Quality Control

TFM ensures that all Tantalum Nitride evaporation materials are clearly tagged and labeled for easy identification and quality assurance. Our packaging is designed to prevent damage during storage and transport, maintaining the integrity of the materials.

Contact Us

As a leading manufacturer and supplier, TFM offers high-purity Tantalum Nitride evaporation materials in various forms, including tablets, granules, rods, and wires. We also provide customized solutions to fit specific requirements. Additionally, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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