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Titanium Nitride Evaporation Materials

VD0756 Titanium Nitride Evaporation Materials, TiN

Catalog No.VD0756
MaterialTitanium Nitride (TiN)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM excels as a top manufacturer and supplier of high-purity Titanium Nitride evaporation materials. We provide these materials in both powder and granule forms, with the flexibility to offer custom solutions based on your specific needs. Whether you require standard or bespoke options, TFM is dedicated to delivering excellence and reliability in all our evaporation materials.

MSDS File

TFM: High-Purity Titanium Nitride Evaporation Materials

TFM offers premium Titanium Nitride evaporation materials, known for their exceptional purity and performance. With the chemical formula TiN, our nitride ceramic materials are crucial in achieving high-quality film deposition. TFM’s dedication to producing TiN with up to 99.9995% purity ensures reliable results in your processes.

Related Products

  • Titanium Evaporation Materials
  • Nitride Ceramic Evaporation Materials

Titanium Nitride Evaporation Materials Specification

Material TypeTitanium Nitride
SymbolTiN
Appearance/ColorCoating of golden color
Melting Point2,947 °C (5,337 °F; 3,220 K)
Density5.21 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Titanium Nitride Evaporation Materials

Our Titanium Nitride materials are utilized in:

  • Deposition Processes: Essential for semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD).
  • Optics: Suitable for wear-resistant coatings, decorative applications, and display technologies.

Packaging and Handling

TFM ensures that Titanium Nitride evaporation materials are meticulously tagged and labeled for easy identification and quality control. We take special care in packaging to prevent any damage during storage and transportation.

Contact Us

As a leading supplier, TFM provides high-purity Titanium Nitride evaporation materials in various forms, including tablets, granules, rods, and wires. We also offer custom solutions tailored to your specific requirements. In addition to evaporation materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about other materials not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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