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Silicon Carbide Evaporation Materials

VD0766 Silicon Carbide Evaporation Materials, SiC

Catalog No.VD0766
MaterialSilicon Carbide (SiC)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a leading provider of high-purity silicon carbide evaporation materials, alongside a diverse selection of other evaporation materials. We supply these materials in both powder and granule forms. Additionally, we offer customized options to meet specific requirements.

MSDS File

Silicon Carbide Evaporation Materials Overview

Silicon carbide (SiC) is a high-performance carbide ceramic material essential for high-quality film deposition. TFM is a leader in producing high-purity silicon carbide evaporation materials, achieving up to 99.9995% purity. Our rigorous quality control ensures reliable and effective performance in various applications.

Silicon Carbide Evaporation Materials Specification

Material TypeSilicon Carbide
SymbolSiC
Appearance/ColorYellow to green to bluish-black
Melting Point2,830 °C (5,130 °F; 3,100 K)
Density3.16 g⋅cm−3 (hex.)
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Silicon Carbide Evaporation Materials

Our silicon carbide evaporation materials are ideal for:

  • Deposition Processes: Used in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied for wear protection, decorative coatings, and displays.

Packaging and Handling

Silicon carbide evaporation materials are meticulously tagged and labeled for precise identification and quality assurance. We ensure that the packaging protects the materials from damage during storage and transportation.

Contact Us

TFM is your trusted source for high-purity silicon carbide evaporation materials. We offer various forms including tablets, granules, rods, and wires, with custom shapes and quantities available upon request. Additionally, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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