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VD0833 Iron Boride Evaporation Materials, FeB

Catalog No.VD0833
MaterialIron Boride (FeB)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier manufacturer and supplier of high-purity iron boride evaporation materials. We offer a diverse range of evaporation materials in both powder and granule forms. Additionally, we provide customized solutions to meet your specific requirements upon request. For tailored options and additional details, feel free to reach out to us.

Iron Boride Evaporation Materials Overview

Iron boride (FeB) evaporation materials from TFM are advanced boride ceramics designed for high-performance deposition processes. With a chemical composition of FeB, these materials are crucial in creating high-quality thin films. TFM is known for its expertise in producing iron boride materials with purity levels reaching up to 99.9995%, ensuring top-notch reliability and effectiveness in various applications.

Specifications of Iron Boride Evaporation Materials

Material TypeIron Boride
SymbolFeB
Appearance/ColorRefractory solid
Melting Point1,389 °C (2,532 °F; 1,662 K)
Density7.3 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Iron Boride Evaporation Materials

Iron boride evaporation materials are essential for several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). These materials are particularly effective in applications such as optics, where they are used for wear protection, decorative coatings, and display technologies.

Packaging and Handling

To ensure the highest quality and efficient handling, iron boride evaporation materials are meticulously tagged and labeled. The packaging is designed to prevent damage during storage and transportation, maintaining the integrity of the product.

Contact TFM

TFM is a leading provider of high-purity iron boride evaporation materials. We offer a variety of forms, including tablets, granules, rods, and wires, with custom options available upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further inquiries about our materials, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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