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Copper Indium Selenide (CIS) Evaporation Materials

VD0844 Copper Indium Selenide (CIS) Evaporation Materials

Catalog No.VD0844
MaterialCopper Indium Selenide (CIS)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a premier provider of top-quality copper indium selenide (CIS) evaporation materials, recognized for its commitment to excellence in manufacturing and supply. We offer a comprehensive range of evaporation materials in both powder and granule forms, ensuring versatility for your needs. Additionally, we provide customized solutions to meet specific requirements upon request, giving you the flexibility to tailor your orders precisely to your project specifications.

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Copper Indium Selenide (CIS) Evaporation Materials Overview

Copper indium selenide (CIS) evaporation materials from TFM are made from a high-purity blend of copper, indium, and selenium. These materials are vital in the deposition processes where high-quality thin films are essential. TFM ensures that its CIS evaporation materials meet stringent purity standards, offering up to 99.9995% purity to guarantee consistent performance in deposition applications.

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Specifications for Copper Indium Selenide (CIS) Evaporation Materials

MaterialCopper Indium Selenide
Chemical FormulaCuInSe₂
Physical StateSolid
Melting Point1327°C (2421°F)
Density5.77 g/cc
Purity Range99.9% – 99.999%
Available FormsPowder, Granules, Custom Shapes

Applications of Copper Indium Selenide (CIS) Evaporation Materials

CIS evaporation materials are integral in various deposition techniques such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). They are particularly useful for creating coatings in optics, including wear-resistant layers, decorative coatings, and display technologies. Their high-quality film deposition is critical for achieving the necessary optical properties and durability in these applications.

Packaging and Handling of Copper Indium Selenide (CIS) Evaporation Materials

TFM ensures that all copper indium selenide (CIS) evaporation materials are packaged with clear labeling for easy identification and to maintain the highest standards of quality control. The packaging is designed to prevent damage during transportation and storage, safeguarding the material’s integrity from the point of manufacture to delivery.

Contact Information for Orders and Customization

TFM is a top-tier supplier of high-purity CIS evaporation materials in various forms, including granules, powder, rods, and custom shapes. In addition, TFM provides an array of evaporation tools such as boats, filaments, heaters, crucibles, and e-beam crucible liners. If you require specific forms, quantities, or further information on pricing, feel free to send an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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