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VD0846 Gallium(III) Selenide Evaporation Materials, Ga2Se3

Catalog No.VD0846
MaterialGallium Selenide (Ga2Se3)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier specializing in high-purity gallium(III) selenide evaporation materials. Our extensive range of evaporation materials comes in both powder and granule forms. We also offer tailored solutions to meet specific requirements, ensuring our products fit your unique needs perfectly.

Gallium(III) Selenide Evaporation Materials Description

Gallium(III) selenide evaporation material, with the chemical formula Ga₂Se₃, is a specialized selenide ceramic used in high-precision deposition processes. TFM offers gallium(III) selenide with exceptional purity levels up to 99.9995%, ensuring that the films deposited are of the highest quality. This material is critical in various applications where precision and reliability are paramount.

Specifications of Gallium(III) Selenide Evaporation Materials

Material TypeGallium(III) Selenide
SymbolGa2Se3
Appearance/ColorReddish-black crystals
Melting Point1,020 °C (1,870 °F; 1,290 K)
Density4.92 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications of Gallium(III) Selenide Evaporation Materials

Gallium(III) selenide is primarily used in semiconductor deposition techniques, including chemical vapor deposition (CVD) and physical vapor deposition (PVD). It is particularly valuable in optics for applications such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

TFM ensures that gallium(III) selenide materials are carefully packaged with clear labeling for easy identification and quality control. The packaging is designed to protect the material from damage during storage and transit.

Contact Information

As a premier supplier of high-purity gallium(III) selenide evaporation materials, TFM provides a range of options including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. In addition to evaporation materials, TFM offers evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and inquiries, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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