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Indium(III) Selenide​ Evaporation Materials

VD0848 Indium(III) Selenide​ Evaporation Materials, In2Se3

Catalog No.VD0848
MaterialIndium Selenide (In2Se3)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

At TFM, we specialize in producing and supplying high-purity indium(III) selenide evaporation materials, along with a diverse range of other evaporation materials. Our offerings include both powder and granule forms of these materials, and we also provide customized options tailored to your specific needs. Whether you require standard forms or bespoke solutions, TFM is dedicated to delivering high-quality products that meet your exact specifications.

MSDS File
Indium(III) Selenide Evaporation Materials Overview

Indium(III) selenide evaporation material, denoted as In₂Se₃, is a high-quality selenide ceramic used extensively in evaporation processes. This material, offered by TFM, is crucial for producing high-purity deposited films. Our In₂Se₃ materials boast purity levels of up to 99.9995%, thanks to our stringent quality control measures.

Product Details

Material TypeIndium(III) selenide
SymbolIn2Se3
Appearance/ColorBlack crystalline solid
Density5.80 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Indium(III) Selenide​ Evaporation Materials are integral to various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). These materials are primarily used in optical applications such as wear protection coatings, decorative finishes, and display technologies.

Packaging and Handling

Our indium(III) selenide materials are meticulously labeled and packaged to ensure safe handling and quality assurance during storage and transportation. We prioritize preventing any potential damage to the material.

Contact Us

TFM is a premier provider of high-purity indium(III) selenide evaporation materials. We offer these materials in various forms, including tablets, granules, rods, and wires, with custom options available upon request. In addition to evaporation materials, we also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing inquiries and additional information on materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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