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Tungsten Diselenide Evaporation Materials

VD0854 Tungsten Diselenide Evaporation Materials, WSe2

Catalog No.VD0854
MaterialTungsten Selenide (WSe2)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity tungsten diselenide evaporation materials. Our extensive range of evaporation materials is available in both powder and granule forms. We also offer tailored solutions to meet specific needs, with custom forms available upon request.

MSDS File

Introduction

Tungsten Diselenide (WSe₂) Evaporation Materials are advanced transition metal dichalcogenide (TMD) sources used for depositing high-quality semiconducting thin films in physical vapor deposition (PVD) processes. With a tunable bandgap, strong spin–orbit coupling, and excellent layered crystallinity, WSe₂ has become a key material for next-generation electronics, optoelectronics, and 2D material research. Evaporation-grade WSe₂ enables controlled film growth for both exploratory R&D and device prototyping.

Detailed Description

WSe₂ evaporation materials are synthesized from high-purity tungsten and selenium precursors with precise stoichiometric control to ensure a stable W:Se ratio. The material is processed into evaporation-friendly forms through controlled synthesis and consolidation steps, minimizing residual impurities and volatile contamination.

As a layered van der Waals material, WSe₂ can be deposited via thermal evaporation or electron-beam evaporation under high vacuum. Proper source geometry and evaporation rate control are essential to maintain compositional fidelity and achieve smooth, continuous films. Deposited WSe₂ films can range from ultrathin layers suitable for 2D electronics to thicker films for optoelectronic and sensing applications.

Compared with oxide or metallic evaporation materials, WSe₂ offers intrinsic semiconducting behavior without the need for post-deposition oxidation or sulfurization/selenization steps, simplifying process integration for TMD-based devices.

Applications

Tungsten Diselenide evaporation materials are widely used in:

  • 2D electronics: Channel layers for field-effect transistors (FETs)

  • Optoelectronics: Photodetectors, light-emitting and light-absorbing devices

  • Spintronics & valleytronics: Materials research leveraging strong spin–orbit coupling

  • Flexible electronics: Thin, mechanically compliant semiconductor films

  • Heterostructures: van der Waals stacks with graphene and other TMDs

  • Academic & industrial R&D: Fundamental studies of layered semiconductors

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionWSe₂ (Tungsten Diselenide)Defines electronic and optical properties
Purity99.9% – 99.99%Reduces defect density in films
StoichiometryW:Se ≈ 1:2Ensures semiconducting behavior
FormPieces, pellets, granulesCompatible with evaporation sources
Evaporation MethodThermal / E-beamFlexible PVD integration
Crystal NatureLayered (van der Waals)Enables 2D thin-film applications

Comparison with Related TMD Materials

MaterialKey AdvantageTypical Application
WSe₂Tunable bandgap, ambipolar transport2D electronics & optoelectronics
MoS₂Mature process ecosystemFETs and sensors
WS₂Strong light–matter interactionPhotonics
MoSe₂Narrower bandgapInfrared optoelectronics

FAQ

QuestionAnswer
Can WSe₂ evaporation materials be customized?Yes, purity, form, and batch size can be tailored.
Which evaporation method is recommended?Both thermal and electron-beam evaporation are used, depending on system design.
Is post-annealing required?Optional annealing can improve crystallinity for certain applications.
How are the materials packaged?Vacuum-sealed with moisture- and contamination-resistant protection.

Packaging

Our Tungsten Diselenide Evaporation Materials (WSe₂) are carefully labeled for traceability and packaged using vacuum sealing with reinforced cushioning. This packaging approach protects against moisture uptake, selenium loss, and mechanical damage during storage and transportation.

Conclusion

Tungsten Diselenide Evaporation Materials (WSe₂) provide a reliable pathway to deposit high-quality TMD thin films with well-defined semiconducting properties. With controlled stoichiometry, flexible evaporation formats, and consistent material quality, WSe₂ is an essential evaporation source for advanced 2D electronics and optoelectronic research.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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