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VD0864 Manganese(II) Telluride Evaporation Materials, MnTe

Catalog No.VD0864
MaterialManganese Telluride (MnTe)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

At TFM, we pride ourselves on being a premier provider of high-purity manganese(II) telluride and a diverse range of evaporation materials. Our offerings include both powder and granule forms to suit various applications. Additionally, we provide custom solutions tailored to meet specific needs upon request.

MSDS File

Manganese(II) Telluride Evaporation Materials Overview

Manganese(II) telluride (MnTe) is a high-purity ceramic evaporation material essential for high-quality deposition processes. Produced by TFM, this material is known for its role in various applications requiring precise film deposition. With a purity level reaching up to 99.9995%, TFM ensures the reliability of its manganese(II) telluride materials through stringent quality control.

Product Specifications

Material TypeManganese(II) Telluride
SymbolMnTe
Appearance/ColorSolid
Melting Point1,150 °C (2,100 °F; 1,420 K) approximation
Density6 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Manganese(II) telluride evaporation materials are utilized in several advanced processes:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

They are particularly important for optical applications, including wear protection, decorative coatings, and displays.

Packaging and Handling

TFM packages manganese(II) telluride evaporation pellets in plastic vacuum bags to protect them during storage and transport. This packaging helps maintain the material’s high quality. Each shipment includes a Certificate of Analysis (COA) for the raw material.

Contact Information

TFM is committed to producing high-purity manganese(II) telluride evaporation materials suitable for a range of applications, including semiconductors, CVD, PVD, and optical technologies. Our expert team combines engineering, manufacturing, and analytical skills to deliver top-quality products. Contact us today to inquire further.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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