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Molybdenum Ditelluride Evaporation Materials

VD0865 Molybdenum Ditelluride Evaporation Materials, MoTe2

Catalog No.VD0865
MaterialMolybdenum Telluride (MoTe2)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity molybdenum ditelluride evaporation materials. Our extensive range includes both powder and granule forms, with customization options available to meet specific needs. Whether you’re looking for standard or tailored solutions, TFM is committed to delivering top-quality evaporation materials that suit your requirements.

MSDS File

Molybdenum Ditelluride Evaporation Materials Overview

Molybdenum ditelluride (MoTe₂) is a high-purity telluride ceramic used as an evaporation material in various deposition processes. At TFM, we specialize in producing MoTe₂ with exceptional purity levels, reaching up to 99.9995%. Our rigorous quality control ensures that our products deliver reliable performance in film deposition.

Product Specifications

Material TypeMolybdenum Ditelluride
SymbolMoTe2
Appearance/ColorBlack/lead-gray solid
Melting PointDecomposes
Density7.7 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Molybdenum ditelluride is utilized in several key areas, including:

  • Semiconductor Deposition: Essential for creating thin films in semiconductor devices.
  • Chemical Vapor Deposition (CVD): Used to produce high-quality thin films and coatings.
  • Physical Vapor Deposition (PVD): Ideal for depositing films in various electronic and optical applications.
  • Optics: Employed for wear protection, decorative coatings, and display technologies.

Packaging Information

Our MoTe₂ evaporation materials are meticulously packaged in plastic vacuum bags to ensure they remain undamaged during storage and transit. Each package includes a Certificate of Analysis (COA) to verify the material’s quality and specifications.

Contact Us

At TFM, we pride ourselves on delivering high-quality molybdenum ditelluride evaporation materials tailored for advanced applications in semiconductors, CVD, PVD, and optical fields. Our experienced engineering, manufacturing, and analytical teams work together to produce top-tier materials. For inquiries or to request a quote, please contact us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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