Boron Nitride E-Beam Crucibles
Boron Nitride E-Beam Crucibles
Boron Nitride E-Beam Crucibles for High-Purity Evaporation Processes
ThinFilmMaterials supplies premium-grade Boron Nitride E-Beam Crucibles designed for use in electron beam evaporation systems. These crucibles are made from high-purity hexagonal boron nitride (h-BN), offering outstanding thermal stability, non-wettability, and chemical inertness—making them ideal for evaporating reactive or high-temperature materials.
Boron Nitride E-Beam Crucibles are widely used as insert liners within copper hearths or molybdenum crucibles to contain materials such as aluminum, gallium, indium, zinc, and other low-to-mid melting point metals. BN’s excellent resistance to thermal shock and minimal contamination properties make it a preferred choice in optical coating, semiconductor, and research-grade thin film deposition.
Key Features:
Material: High-purity hexagonal boron nitride (h-BN)
Temperature tolerance: Up to ~2000 °C in vacuum
Chemically inert; does not react with most metals
Non-wetting surface prevents material adhesion
Available in standard and custom sizes for E-beam hearths
Excellent dielectric and thermal shock resistance
Applications:
Boron Nitride E-Beam Crucibles are commonly used in:
Electron beam evaporation sources for PVD systems
Optical coatings (e.g., mirrors, lenses, solar filters)
Semiconductor thin film and metal layer deposition
Research labs handling reactive or low-vapor-pressure materials
Precious metal evaporation where purity is critical
ThinFilmMaterials provides standard BN crucible inserts in round, conical, or stepped shapes to fit various hearth configurations. Custom dimensions, purity grades, and rapid delivery options are available upon request.