Micro-Electronic Basket Heaters
TFM Engineering offers tungsten filaments in various shapes and wire counts. Select a heater shape that closely matches the size of your substrate and the properties or shape of the material you want to heat.
Please Select a Shape
Coil Shape
6 Coils (Tungsten)
#001: 1 Wire * Diameter 0.762mm / 0.03″
#002: 3 Wires * Diameter 0.635mm / 0.025″
4 Coils (Tungsten)
#003: 1 Wire * Diameter 0.762mm / 0.03″
#004: 3 Wires * Diameter 0.635mm / 0.025″
Loop Shape
1 Loop (Tungsten)
#005: 1 Wire * Diameter 0.762mm / 0.03″
#006: 3 Wires * Diameter 0.635mm / 0.025″
Point Shape
1 Point (Tungsten)
#007: 1 Wire * Diameter 0.762mm / 0.03″
#008: 3 Wires * Diameter 0.635mm / 0.025″
3 Point (Tungsten)
#009: 1 Wire * Diameter 0.762mm / 0.03″
#010: 3 Wires * Diameter 0.635mm / 0.025″
Spiral Shape
2.5 Turn Spiral (Tungsten)
#011: 1 Wire * Diameter 0.762mm / 0.03″
#012: 3 Wires * Diameter 1.000mm / 0.04″
3.5 Turn Spiral (Tungsten)
#013: 1 Wire * Diameter 0.762mm / 0.03″
#014: 3 Wires * Diameter 1.000mm / 0.04″
Description
Tungsten filaments are commonly used in high vacuum thin film deposition systems to heat substrates or crucibles containing the material to be deposited. The choice of filament shape and number of wires depends on the substrate’s area requirements and the characteristics of the material being heated.
Some key considerations when selecting a tungsten filament:
- Filament diameter: Thicker filaments can reach higher temperatures and are more robust, while thinner filaments are more flexible and can be coiled into smaller diameters.
- Number of wires: Single wire filaments are simple and inexpensive, while multi-wire filaments provide more uniform heating over a larger area.
- Filament shape: Coiled filaments are commonly used as they effectively increase the overall filament diameter, slowing evaporation and increasing lifetime. Straight filaments are simpler but may sag at high temperatures.
- Substrate size: The filament should be sized to match the substrate diameter. Larger substrates require longer filaments, while smaller substrates allow tighter coil diameters.
- Material properties: The filament must be able to reach the required temperature to evaporate or melt the source material. Tungsten is ideal due to its high melting point and low vapor pressure at high temperatures.
In summary, choosing the right tungsten filament involves balancing factors like cost, size, heating uniformity and lifetime to match the specific requirements of the deposition process and substrate. Consulting with the filament manufacturer can help select the optimal configuration.
TFM has rich experience in customizing micron-electronic filaments, with short lead times and competitive pricing.
Frequently Asked Questions
What are micro‐electronics evaporation sources?
They are compact thermal evaporation sources designed for small-scale systems. Typically less than 2″ in length, these sources are optimized for low power deposition of thin films in microelectronic applications.
What materials are used to fabricate these sources?
Micro‐electronics sources are commonly made from tungsten for its high melting point and durability, with alternatives in tantalum and molybdenum. Some sources are also available with alumina coatings to prevent material wetting and alloying.
What applications are best suited for micro‐electronics evaporation sources?
They are ideal for thin film deposition in semiconductor devices, microelectromechanical systems (MEMS), and sample preparation, particularly when using expensive or small quantities of materials in research and R&D environments.
How do micro‐electronics sources differ from standard evaporation sources?
Micro‐electronics sources are smaller and require lower power, making them suitable for compact vacuum systems. They deliver precise control over deposition and are optimized for low-volume, high-precision applications.
What configurations are available in the micro‐electronics line?
The range includes micro‐electronic boats, thermal filaments, basket heaters, and shielded crucible heaters. These configurations allow for versatility in depositing various materials and adapting to specific system geometries.
Why is tungsten the material of choice?
Tungsten’s high melting point, low vapor pressure at high temperatures, and excellent thermal stability make it ideal for evaporation processes, ensuring high film quality and durability of the evaporation source.
How does an alumina coating benefit these sources?
Alumina coatings prevent wetting and alloying between the evaporant and the refractory metal, which enhances film uniformity, extends source life, and minimizes material loss during deposition.
What are the typical power requirements for micro‐electronics evaporation sources?
These sources are designed for low-power applications, often operating at voltages below 2–3 V and current levels tailored to their small dimensions. Exact requirements depend on the source design and the evaporant material.
What advantages do micro‐electronic sources offer for R&D?
Their small size and precise control allow researchers to deposit very thin, uniform films using minimal quantities of expensive materials. This is particularly beneficial for prototyping and iterative device development.
How are micro‐electronic evaporation sources integrated into existing systems?
They are designed to be compatible with standard vacuum chamber holders and low-power supply units, often featuring plug-and-play interfaces and documented power requirements to ensure seamless integration.
What are common troubleshooting tips for these sources?
Ensure the power supply matches the specified voltage/current, verify that the source is free of contamination, and check for proper alignment within the chamber. If deposition is non-uniform, consider using an alumina-coated version to minimize material wetting.
What are the primary advantages of micro-electronics evaporation sources?
Micro-electronics evaporation sources offer several key benefits:
Compact Size for Limited Spaces – These sources are typically less than 2 inches (50.8 mm) in length, making them ideal for systems with restricted space or low power availability.
High-Purity Film Deposition – By utilizing high-quality materials and precise control, these sources deposit films with minimal impurities, ensuring optimal device performance.
Versatility in Material Deposition – They accommodate a wide range of materials, including metals and dielectrics with high melting points, making them suitable for various applications.