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VD0585 Tin Evaporation Materials, Sn

Catalog No.VD0585
MaterialTin (Sn)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a leading manufacturer and supplier of high-purity tin evaporation materials, alongside a broad range of other evaporation materials. We provide these materials in both powder and granule forms, with custom options available upon request.

MSDS File

Tin Evaporation Materials Description

Tin is a metallic element known for its silvery-white luster, low melting point, and flexibility. It is soft and pliable, and is chemically inert, meaning it does not react with air or water. Tin reacts slowly with dilute hydrochloric acid, and with concentrated hydrochloric acid, it forms stannous chloride. It does not react with dilute sulfuric acid but will react with concentrated hot sulfuric acid to produce tin(IV) sulfate. Additionally, concentrated hot nitric acid reacts with tin to generate β-stannic acid.

High-purity tin evaporation materials are essential for achieving superior film quality in deposition processes. TFM specializes in producing tin evaporation materials with purity levels up to 99.999%, ensuring reliability and performance through rigorous quality assurance practices.

Tin Evaporation Materials Specification

Material TypeTin
SymbolSn
Color/AppearanceSilvery Lustrous Gray, Metallic
Melting Point232 °C
Density7.28 g/cc
Thermal Conductivity66.6 W/m.K
Coefficient of Thermal Expansion22 x 10-6/K
SynonymsTin Pellets, Tin Pieces, Tin Evaporation Pellet, Sn Pellets, Sn Pieces, Sn Evaporation Pellet

Tin Evaporation Materials Applications

  • Deposition Processes: Utilized in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and displays.

Tin Evaporation Materials Packaging

Our tin evaporation materials are meticulously handled to prevent damage during storage and transportation, ensuring they maintain their original quality.

Contact Us

TFM provides tin evaporation materials in a variety of forms, purities, sizes, and price ranges. We are committed to producing high-purity e-beam evaporation materials with optimal density and minimal average grain sizes. For current pricing on evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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