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VD0591 Zinc Evaporation Materials, Zn

Material Type：Zinc
Symbol：Zn
Color/Appearance：Bluish Pale Gray, Metallic
Purity：99.9% ~ 99.995%
Shape：Powder/ Granule/ Custom-made

TFM is a leading manufacturer and supplier of high-purity zinc evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, with customized options available upon request.

MSDS File

Zinc Evaporation Materials Description

Zinc, positioned in the 4th period and group IIB of the periodic table, is a light grey transition metal and ranks as the fourth most common metal. It plays a crucial role in modern industries, particularly in battery manufacturing, and is essential as a trace element for the human body.

High-purity zinc evaporation materials are vital for ensuring high-quality deposited films in various applications. TFM specializes in producing zinc evaporation materials with up to 99.995% purity, employing stringent quality assurance processes to ensure product reliability.

Zinc Evaporation Materials Specification

Atomic Number30
Density7.14 g/cm (near r.t.)
Color/AppearanceSilver Gray
Thermal Conductivity116 W/m.K
Melting Point419.53 °C
Boiling Point907 °C
Coefficient of Thermal Expansion30.2 x 10-6/K
Z Ratio0.514
SynonymsZinc Pellets, Zinc Pieces, Zinc Evaporation Pellet, Zn Pellets, Zn Pieces, Zn Evaporation Pellet

 

Zinc Evaporation Materials Applications

  • Deposition Processes: Used in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied for wear protection, decorative coatings, and displays.

Zinc Evaporation Materials Packaging

Our zinc evaporation materials are carefully handled to prevent damage during storage and transportation, preserving their original quality.

Contact Us

TFM’s zinc evaporation materials are available in various forms, purities, sizes, and prices. We specialize in producing high-purity e-beam evaporation materials with optimal density and minimal average grain sizes. For current pricing on evaporation pellets and other deposition materials not listed, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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