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zirconium-tetrafluoride

VD0798 Zirconium Tetrafluoride Evaporation Materials, ZrF4

Catalog No.ZrF4-VD
MaterialZirconium Fluride (ZrF4)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier of high-purity zirconium tetrafluoride and various other evaporation materials. We provide these materials in both powder and granule formats, and we can also accommodate custom requests to meet specific needs. Whether you require standard or tailored solutions, TFM is equipped to deliver exceptional quality and reliability.

MSDS File

Zirconium Tetrafluoride Evaporation Materials Overview

Zirconium Tetrafluoride (ZrF4) evaporation materials are crucial in advanced deposition processes, contributing to the production of high-quality films. At TFM, we provide zirconium tetrafluoride with exceptional purity levels of up to 99.9995%. Our stringent quality control processes ensure that each product meets the highest standards of reliability and performance.

Zirconium Tetrafluoride Evaporation Materials Specification

Material TypeZirconium Tetrafluoride
SymbolZrF4
Appearance/ColorWhite crystalline solid
Melting Point910 °C (1,670 °F; 1,180 K)
Density4.43 g/cm3 (20 °C)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Zirconium tetrafluoride is utilized in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

It is particularly effective for optics applications such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Our zirconium tetrafluoride evaporation materials are carefully labeled and packaged to ensure efficient identification and maintain quality control. We take special measures to prevent damage during storage and transport, ensuring that materials arrive in pristine condition.

Contact Us

TFM is a leading manufacturer of high-purity zirconium tetrafluoride evaporation materials. We offer a variety of shapes, including tablets, granules, rods, and wires, with custom options available to suit your needs. Additionally, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing information or to inquire about other materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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