CF Flanged SS Fluorocarbon Bonnet Gate Valve (Manual)

Valves for Semiconductor and Processing Applications

Valves designed for semiconductor and other processing applications are essential for isolating pumps and sample entry locks from high vacuum (HV) or ultra-high vacuum (UHV) work chambers. These valves ensure precise control and reliability in critical environments.

Key Features:

  • CF Flanged with Fluorocarbon O-Ring: Capable of operating in atmospheric conditions down to the 10⁻⁹ torr pressure range, these valves can be baked up to 150°C while in the open position, maintaining efficiency and integrity.
  • Electropolished Stainless Steel Construction: Made from high-grade stainless steel that is electropolished for enhanced surface finish and corrosion resistance, ensuring long-term durability.
  • Vacuum Brazed at 1,100°C: The valves are vacuum brazed at high temperatures to guarantee reliable operation under HV and UHV conditions, minimizing the risk of failure.
  • High Conductance and Compact Design: Engineered to provide exceptional conductance while maintaining a compact footprint, making them suitable for space-constrained setups.
  • Shock-Free Operation: Designed for minimal vibration and shock, these valves ensure stable performance during operation.
  • Longevity: With a service life of up to 100,000 cycles before requiring maintenance, these valves offer reliability and efficiency for demanding applications.

TFM provides high-quality valves tailored for semiconductor processing, ensuring optimal performance in critical vacuum applications.

Specifications Table

ManufacturerTFM
PressureTorr
Min: 7.501 x 10-10 Torr
Max: 760 Torrmbar
Min: 1.000 x 10-9 mbar
Max: 1013 mbar
RatesHelium Leak Rate
2.000 x 10-9 mbar*L/s
1.500 x 10-9 Torr*L/s
TemperatureActuator
60.0 ºC
140 ºFBakeable
150 ºC
302 ºF
Shaft Seal
Material
Bellows Sealed
Cycle
Life
100,000
Actuator
Type
Manual
Max Differential Pressure
Before Open
22.5  Torr
Bonnet
Seal Type
Fluorocarbon (FKM)
Valve Body
Material
Stainless Steel
Valve Seal
Material
Fluorocarbon (FKM)

Ordering Table

DrawingTooltip Flange Size Bonnet Seal Type Thread Part Number
Tooltip DN16CF (1.33" OD) Fluorocarbon (FKM) #8-32 SG0063MVCF
Tooltip DN16CF (1.33" OD) Fluorocarbon (FKM) M4 SG0063MVCFM
Tooltip DN35CF-DN40CF (2.75" OD) Fluorocarbon (FKM) 2001/4/28 SG0150MVCF
Tooltip DN35CF-DN40CF (2.75" OD) Fluorocarbon (FKM) M6 SG0150MVCFM
Tooltip DN50CF (3.38" OD) Fluorocarbon (FKM) 5/16-24 SG0200MVCF
Tooltip DN50CF (3.38" OD) Fluorocarbon (FKM) M8 SG0200MVCFM
Tooltip DN63CF (4.50" OD) Fluorocarbon (FKM) 5/16-24 SG0250MVCF
Tooltip DN63CF (4.50" OD) Fluorocarbon (FKM) M8 SG0250MVCFM
Tooltip DN75CF (4.63" OD) Fluorocarbon (FKM) 5/16-24 SG0300MVCF
Tooltip DN75CF (4.63" OD) Fluorocarbon (FKM) M8 SG0300MVCFM
Tooltip DN100CF (6.00" OD) Fluorocarbon (FKM) 5/16-24 SG0400MVCF
Tooltip DN100CF (6.00" OD) Fluorocarbon (FKM) M8 SG0400MVCFM
Tooltip DN160CF (8.00" OD) Fluorocarbon (FKM) 5/16-24 SG0600MVCF
Tooltip DN160CF (8.00" OD) Fluorocarbon (FKM) M8 SG0600MVCFM
Tooltip DN200CF (10.00" OD) Fluorocarbon (FKM) 5/16-24 SG0800MVCF
Tooltip DN200CF (10.00" OD) Fluorocarbon (FKM) M8 SG0800MVCFM
Tooltip DN250CF (12.00" OD) Fluorocarbon (FKM) 5/16-24 SG1000MVCF
Tooltip DN250CF (12.00" OD) Fluorocarbon (FKM) M8 SG1000MVCFM
Tooltip DN275CF (13.25" OD) Fluorocarbon (FKM) 2003/8/24 SG1075MVCF
Tooltip DN275CF (13.25" OD) Fluorocarbon (FKM) M10 SG1075MVCFM
Tooltip DN295CF (14.00" OD) Fluorocarbon (FKM) 2003/8/24 SG1200MVCF
Tooltip DN295CF (14.00" OD) Fluorocarbon (FKM) M10 SG1200MVCFM

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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