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Protection Valve System

Introducing TFM’s latest innovation from TFM Company: our patented Protection Vacuum Gate Valve. Designed for rapid response, the valve closes in under 0.3 seconds to protect in-process products during vacuum pump failures. With bellows-sealed, pneumatic actuation, this durable SS valve system can monitor up to four pumps and features local or remote control, along with an LCD status display.

Engineered for long life, its low particle generation mechanism is shielded in both open and closed positions, preventing particulate buildup even in harsh process conditions.

Key Features:

  • Fast pneumatic actuation (<0.3 seconds to close)
  • Patented shielding mechanism for particle protection
  • O-ring sealed actuator
  • Long lifespan in adverse conditions
  • Local or remote control with LCD status display
  • Simple routine maintenance
  • Supports 1, 2, 3, or 4-channel control (on request)
  • UPS and heat jacket options (on request)
  • Adjustable delayed down time (on request)

Applications:

Ideal for vacuum pump or chamber isolation in demanding processes, including:

  • Plasma etching, cleaning, and desmearing
  • Chemical Vapor Deposition (CVD) processes (MO, PE, HDP, LP, AP)
  • Nanotechnology processes with high particulate levels
  • Thin film photovoltaic panel production

  • Specifications Table

  • Pressure Range (torr)1.0 x 10-6 ~ 12 x 105 Pa (abs)
    Differential Press (torr)Opening Direction: 0.12MPa
    Closing Direction: 0.12MPa
    Max ΔPress Before Open (torr)0.005MPa
    MaterialBellows: STS 316L
    Gate (seat): STS 304, AL6061
    Valve housing, Bonnet, Shaft (Stem), Bellows end piece: STS 304
    Bonnet seal, Pneumatic seal: FKM (Viton®)
    Gate seal, Vacuum seal: FKM (Viton®), FFKM (Kalrez®) on request
    Leak Rate (cc/sec)Housing: <1.0 x 10-10 PA* m3/sec
    Seat (Gate): <1.3 x 10-10 PA* m3/sec (±)
    Bakeout Limit. (°C)Body: 105°C (Viton® o-ring) | 150°C (FFKM o-ring)
    Actuator: 60°C
    MountingHorizontal

Dimensional Drawings

Video

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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