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Safety Locking Angle Valve (Manual)

The locking valve is a versatile angle valve designed for high vacuum and foreline applications, featuring a secure locking mechanism for the closed position, complemented by a red visual indicator on the actuator.

Features and Benefits:

  • Long Life Cycle: Durable design ensures extended use.
  • Cost Savings: Economical solution for various applications.
  • Particle Reduction: Minimizes contamination for cleaner operations.
  • Mechanical Lock: Guarantees a secure closed position for enhanced safety.
  • Visual Confirmation: Red indicator provides immediate verification of valve status.
  • Easy Maintenance: Simplifies servicing and operation.
  • Compact Structure: Space-efficient design ideal for tight installations.

Specifications Table

ManufacturerTFM
PressureTorr
Min: 5.000 x 10-9 Torr
Max: 760 Torrmbar
Min: 6.600 x 10-9 mbar
Max: 1000 mbar
RatesHelium Leak Rate
5.000 x 10-8 mbar*L/s
4.900 x 10-8 sccs
3.700 x 10-8 Torr*L/s
TemperatureActuator
60.0 ºC
140 ºFBakeable
60.0 ºC
140 ºFClosed Bake
100 ºC
212 ºFOpen Bake
100 ºC
212 ºF
Shaft Seal
Material
300 Series SS Bellows
Cycle
Life
10,000
Actuator
Type
Manual
Position
Indicators
Yes
Normal PositionAny
Max Differential Pressure
Before Open
750  Torr
Bonnet
Seal Type
Fluorocarbon (FKM)
Valve Body
Material
304L SS
Valve Seal
Material
Fluorocarbon (FKM)
Locking
Function
Full Close Self Lock

Ordering Table

Drawing Flange Size Bonnet Seal Type Position Indicators Part Number
Tooltip KF25 (1.57" OD) Fluorocarbon (FKM) Yes SAL0100MVQF

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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