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V75 Series Rectangular Gate Valves (Large)

Applications

  • Plasma Etch, CVD, Sputter Deposition
  • Manufacturing of solar panels
  • Semiconductor processing
  • LCD/flat panel processes
  • All other cluster vacuum systems

Features

  • Removable valve housing cover
  • Patented L-motion link and dual shifts without springs in the actuator enable faster, smoother actuation with significantly reduced vibration
  • Dust seal on the vacuum side of the bonnet flange that virtually eliminates particulate from entering the bellows
  • Mechanical locking so at the end of gate travel the valve locks into position
  • Welded bellows actuator seal
  • Bonnet flange bolts are designed with retainers to eliminate bolts from falling out upon disassembly
  • Available with gates up to 150mm tall and 1500mm wide

Options

  • Custom sizes available
  • Various o-ring compounds (Kalrez®, Chemraz®, etc.)

Specifications Table

Temperature (°C)Valve body: 120°C
Valve actuator: 80°C
Pressure Range (torr)1 X 10-7 mbar – ATM
Differential Press (torr)≤ 1.2 bar in either direction
MaterialValve body, bonnet seal, gate: AL6061
Welded bellows: AM350
Valve actuator: SS 304, AL6061
Seal MaterialFluorocarbon (option KALREZ, ETC)
Leak Rate (cc/sec)<1 X 10-7 mbar. l/s
Cycles Until Service (approx.)≥ 1 million
Position IndicatorFesto: SME-8M-DS-24V-k-2.5-OE
OperationDouble acting

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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