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VD0544B Copper(I) Sulfide Evaporation Material

MSDS File
Material TypeCopper Sulfide
SymbolCu2S
Color/AppearanceDark gray to black
Melting Point (°C)1,100
Theoretical Density (g/cc)5.6
Z Ratio–
E-Beam–
Thermal Evaporation TechniquesBoat:  –
Crucible:  –
E-Beam Crucible Liner Material–
Temp. (°C) for Given Vap. Press. (Torr)–
Comments–

Copper(I) Sulfide Evaporation Material

TFM offers high-purity Copper(I) Sulfide (Cu₂S) Evaporation Material, widely utilized in thin-film deposition, optoelectronics, and photovoltaic applications. Known for its excellent electrical and optical properties, Cu₂S is an essential material in the development of semiconductor devices, infrared detectors, and energy conversion technologies.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Ensures superior performance in thin-film coatings and advanced electronics.

  • Excellent Conductivity & Stability – Provides reliable electrical and optical properties for semiconductor applications.

  • Optimized for Thin-Film Deposition – Suitable for thermal evaporation and electron beam (E-beam) evaporation techniques.

  • Versatile Availability – Offered in pellets, pieces, and powder to meet diverse industrial and research needs.

  • Room Temperature Stability – Maintains structural integrity for long-term usability and storage.

Applications

  • Thin-Film Solar Cells – Used in photovoltaic applications to enhance energy conversion efficiency.

  • Infrared Detectors & Sensors – Key material in thermal imaging, night vision, and spectroscopic technologies.

  • Semiconductor Coatings – Ideal for conductive layers, thin-film transistors, and optoelectronic components.

  • Thermoelectric Devices – Plays a role in energy harvesting and temperature control systems.

  • Advanced Research & Development – Supports innovative studies in material science and nanotechnology.

Industry Impact

TFM’s Copper(I) Sulfide Evaporation Material provides a high-purity, stable, and efficient solution for semiconductor manufacturing, renewable energy, and optoelectronic innovations. Designed for precise thin-film deposition, Cu₂S from TFM ensures reliable performance and high-quality results in cutting-edge electronic and energy applications.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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