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Chromium Cr Rotary Sputtering Target

Chromium (Cr) Rotary Sputtering Target

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Chromium Cr Rotary Sputtering Target

TFM offers high-quality Chromium Cr rotary sputtering targets, designed for thin-film deposition in a variety of advanced applications, including semiconductors, coatings, and electronics. Chromium Cr targets are known for their exceptional hardness, high wear resistance, and corrosion resistance, making them ideal for producing thin films that require superior durability and reliability in harsh environments.

The rotary sputtering target design ensures efficient, uniform deposition of Chromium Cr films, which are commonly used in hard coatings, optical coatings, and magnetic thin films. Chromium Cr films provide high adhesion strength, making them ideal for protective coatings on materials exposed to extreme temperatures and abrasion. Chromium oxide (Cr₂O₃) films are also widely used in decorative coatings, where their aesthetic appeal and excellent resistance to corrosion are highly valued.

Chromium Cr films are frequently used for tribological coatings to enhance the wear resistance of components such as cutting tools, engine parts, and molds. Additionally, Chromium nitride (CrN) films, created from Chromium targets, are widely employed in hard coatings for tooling and machinery, offering enhanced durability and high-temperature performance. Chromium-based films also play a crucial role in magnetic storage devices and thin-film transistors due to their electrical properties.

TFM provides customized Chromium Cr rotary sputtering targets, ensuring precise control over material composition and purity to meet the specific requirements of high-performance applications. These targets deliver consistent and reliable results for thin-film deposition in industries such as electronics, automotive, aerospace, and medical devices.

Our Chromium Cr rotary sputtering targets are manufactured to the highest standards, offering superior material quality and consistent sputtering performance. With low impurity levels, high density, and optimized sputtering characteristics, TFM’s Chromium Cr targets are ideal for producing high-quality thin films for next-generation technologies.

Specifications

MaterialsChromium Rotary Sputtering Target
SymbolCr
Purity99.5% – 99.95%
Theoretical Density (g/cc)7.2
Melting Point (°C)1,857
Production MethodSpraying Type, Monolithic Type (HIP)
SizeAs per customer’s drawings
Relative Density>= 95%
Grain Sizes< 100 µm
Oxygen Content (ppm)5000 (Spraying Type), 800-1500 (HIP)
Film Coating UniformityHigh uniformity & density
Film Coating Current DensityNot suitable for prolonged high current operation
High Power StabilityStable under high power and extended operation

Applications

  • Thin Film Photovoltaic Solar Industry
  • Flat Panel Display Industry
  • Construction / Automotive Glass Industry
  • Decorative / Functional Coating Industry

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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