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ST0001 Aluminum Sputtering Target, Al

Chemical Formula: Al
Catalog Number: ST0001
CAS Number: 7429-90-5
Purity: 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Aluminum Sputtering Target Description

Aluminum Element Aluminum
BauxiteBauxit

Aluminum sputtering targets share the same properties as metallic aluminum, a silvery-white, soft, non-magnetic, and ductile metal. Aluminum constitutes about 8% of the Earth’s crust, making it the third most abundant element after oxygen and silicon. Although aluminum is the most plentiful metal in the crust, it is rare in pure form due to its high reactivity.

Aluminum is typically found in over 270 minerals, with bauxite being the primary ore, consisting mainly of hydrated alumina and varying amounts of iron oxides. Aluminum layers are used for reflective coatings in telescopes, automotive headlamps, mirrors, packages, and toys. Aluminum sputtering targets and evaporation materials are extensively utilized in aerospace, automotive lighting, OLED, and optical    industries.

 

Aluminum Sputtering Target Specification

Material TypeAluminum
SymbolAl
Color/AppearanceSilvery, Metallic
Melting Point660°C
Density2700 kg/m3
SputterDC
Type of BondIndium, Elastomer
CommentsAlloys W/Mo/Ta. Flash evap or use BN crucible
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Aluminum Sputtering Target Application

Aluminum, known for its excellent thermal properties, is both malleable and ductile. Aluminum and its alloys are commonly used in aircraft assemblies and engine components. The aluminum sputtering target is utilized for thin film deposition in applications such as fuel cells, decorative coatings, semiconductors, displays, LEDs, photovoltaic devices, and glass coatings.

Aluminum Sputtering Target Bonding Services

Specialized bonding services for Aluminum Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Aluminum Sputtering Target Manufacturing processes

  • Production and purification of aluminum

Aluminum is extracted from bauxite by isolating Al2O3 and then electrolyzing it in molten cryolite, achieving a purity above 99%. However, this level of purity is insufficient for aluminum sputter targets, which require extremely high purity. High-purity aluminum, used for sputter targets, is produced using segregation, three-layer electrolysis, or combined regional melting methods, making it more expensive than industrial-grade aluminum. TFM offers high-quality aluminum targets at competitive prices.

Alunium target
Aluminum Sputtering Target
  • Deformation treatment of aluminum sputtering target

High-purity aluminum ingots are forged, rolled, and heated to refine the crystal grains and increase density, meeting the standards for aluminum sputtering targets. The processed aluminum material is then shaped into the specific target size needed for vacuum coating, requiring high precision and superior surface quality.

Aluminum Sputtering Target Packing

Our Aluminum Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Aluminum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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Aluminum 99.99%, Diameter 50.8*Height 2.5mm (+/-0.1mm), Aluminum 99.99%, Diameter 50.8*Height 5mm (+/-0.1mm)

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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