Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
copper-indium-gallium-selenide-sputtering-target-removebg-preview-1

CuCrO2 Sputtering Target

MSDS File

CuCrO₂ Sputtering Target Description

TFM provides high-purity CuCrO₂ sputtering targets, a p-type transparent conductive oxide (TCO) material that has gained significant attention for its excellent optical transparency, electrical conductivity, and chemical stability. As a delafossite-type oxide, CuCrO₂ offers promising performance in next-generation transparent electronics, thin-film solar cells, and oxide-based transistors.

CuCrO₂ thin films can be deposited using RF magnetron sputtering or pulsed laser deposition (PLD) and exhibit high hole mobility, wide bandgap (~3.1 eV), and good thermal stability, making them suitable for demanding optoelectronic environments.

CuCrO₂ Sputtering Target Specification

PropertyValue
Chemical FormulaCuCrO₂
Molecular Weight146.53 g/mol
Crystal StructureDelafossite (rhombohedral)
Purity≥ 99.9% (3N) metals basis
ColorGrayish green or dark gray solid
Density~6.0–6.2 g/cm³
Available Diameters1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thicknesses0.125″, 0.250″
Bonding OptionsIndium or elastomer bonding to copper backing plate

Custom dimensions, compositions, and backing plates are available on request.

Applications of CuCrO₂ Thin Films

  • p-type Transparent Conductive Oxide (TCO) layers

  • All-oxide solar cells (e.g., CuCrO₂/ZnO heterojunctions)

  • Oxide Thin Film Transistors (TFTs)

  • Photodetectors and UV sensors

  • Flexible optoelectronic devices

  • Thermoelectric materials

CuCrO₂ is especially valuable because it complements widely-used n-type TCOs like ZnO or ITO, enabling all-oxide p-n junctions for transparent electronics.

Handling and Processing Notes

  • Elastomer bonding is recommended due to its brittle ceramic nature and moderate thermal conductivity.

  • Avoid rapid thermal cycling during sputtering to reduce cracking risk.

  • Use RF sputtering for stable stoichiometry control in oxide environments.

Packaging and Quality Assurance

Each CuCrO₂ sputtering target from TFM is:

  • Individually packaged in vacuum-sealed anti-static bags

  • Labeled with composition, purity, batch number, and dimensions

  • Tested for density, phase purity, and mechanical integrity

All targets are handled in cleanroom conditions to ensure zero contamination and reliable thin film performance.

Get Contact

TFM specializes in advanced oxide materials for thin film deposition. Our CuCrO₂ sputtering targets are available in standard and custom configurations, with expert support for lab-scale or industrial production environments.
Contact us for a quote or technical datasheet.

Order Now

CuCrO2 target 3N ø2"*6mm, CuCrO2 target with 4% Mg Doped ø2"*6mm Multi Phase

Reviews

There are no reviews yet.

Be the first to review “CuCrO2 Sputtering Target”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top