Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

Zirconium Yttrium Sputtering Target, ZrY

Zirconium Yttrium Sputtering Target (ZrY)

Introduction

The Zirconium Yttrium (ZrY) Sputtering Target is a specialized alloy material developed for thin film deposition. By combining zirconium’s corrosion resistance and high-temperature stability with yttrium’s ability to improve structural integrity and ionic conductivity, ZrY targets provide high-performance coatings with enhanced durability and functionality. They are widely used in semiconductor devices, optical coatings, energy storage systems, and R&D applications.

Detailed Description

Zirconium-yttrium alloys are engineered to improve the mechanical and chemical stability of deposited films. The introduction of yttrium modifies the grain structure of zirconium, enhancing resistance against oxidation and improving ionic transport properties.

When processed into sputtering targets, ZrY materials are typically manufactured by vacuum melting or powder metallurgy techniques, followed by precise machining. The resulting targets achieve:

  • High density and uniform microstructure for consistent sputtering performance.

  • Tailored Zr:Y atomic ratios (commonly 50/50 at%, or other compositions upon request).

  • Excellent adhesion and low defect generation in thin film deposition.

Applications

Zirconium Yttrium sputtering targets are applied in:

  • Semiconductor thin films – barrier layers, diffusion coatings, and functional oxides.

  • Optical coatings – anti-reflective and wear-resistant layers for sensors and displays.

  • Solid oxide fuel cells (SOFCs) – electrolyte and electrode coatings for improved ionic conductivity.

  • Protective coatings – corrosion-resistant films in aerospace and energy industries.

  • R&D – material studies on mixed oxide systems and advanced thin film materials.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.5% – 99.9%Minimizes film contamination
CompositionZr-Y (custom ratios, e.g., 50:50 at%)Tailored for application needs
Diameter25 – 200 mm (custom)Fits multiple sputtering systems
Thickness3 – 10 mmBalances target life and sputtering rate
Backing PlateCopper / MolybdenumImproves heat dissipation and stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Zirconium Yttrium (ZrY)Enhanced ionic conductivity & stabilitySemiconductor & SOFC
Zirconium Oxide (ZrO₂)High thermal stability, low conductivityOptical & protective coatings
Yttrium Oxide (Y₂O₃)Excellent ionic conductivitySolid oxide electrolytes
Zirconium Carbide (ZrC)High hardness and toughnessCutting tools, coatings

FAQ

QuestionAnswer
Can the ZrY composition be customized?Yes, Zr:Y ratios (e.g., 50/50, 60/40 at%) can be tailored.
What bonding options are available?Copper or molybdenum backing plates are standard.
How are the targets packaged?Vacuum-sealed, foam-protected, and shipped in export-safe cartons.
Is ZrY suitable for high-temperature applications?Yes, it performs well in thermal and oxidative environments.
Which industries use ZrY most?Semiconductors, optics, fuel cells, aerospace, and advanced materials R&D.

Packaging

Each Zirconium Yttrium Sputtering Target is vacuum-packed with external labeling and foam cushioning to ensure protection from contamination or damage. Export-grade cartons or wooden crates are used for long-distance shipping.

Conclusion

The ZrY sputtering target combines zirconium’s durability with yttrium’s functional benefits, resulting in advanced thin films with enhanced structural and ionic properties. Its versatility makes it a reliable choice for both industrial production and experimental research.

For detailed specifications and quotations, please contact us at [sales@thinfilmmaterials.com].

Order Now

ZrY target 50/50 at% 99.5% ø200×6mm, ZrY target Y-3% at% 99.5% ø200×6mm, ZrY target 88/12 at% 99.5% ø200×6mm

Reviews

There are no reviews yet.

Be the first to review “Zirconium Yttrium Sputtering Target, ZrY”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top