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Scandium Gallium Iron Oxide Sputtering Target, ScGaFeO₃

Introduction

Scandium Gallium Iron Oxide Sputtering Targets are advanced complex-oxide materials engineered for next-generation thin film deposition. By combining scandium’s lattice-stabilizing effect, gallium’s electronic modulation capability, and iron’s magnetic functionality, this material system enables precise control over electrical, magnetic, and optical properties. It is widely studied and applied in functional oxide electronics, spintronic research, and advanced optoelectronic devices where compositional accuracy and film uniformity are critical.

Detailed Description

The Scandium Gallium Iron Oxide Sputtering Target is typically manufactured as a dense ceramic target through high-purity powder synthesis, controlled stoichiometric mixing, and hot-pressing or HIP sintering. This process ensures excellent phase uniformity and minimizes porosity, which directly contributes to stable sputtering behavior and consistent film composition.

Scandium plays a key role in stabilizing crystal structures and reducing defect density in deposited films. Gallium contributes to bandgap tuning and carrier transport optimization, while iron introduces magnetic ordering or magneto-optical response depending on deposition conditions and substrate selection. The resulting oxide films can exhibit tailored conductivity, dielectric response, and magnetic anisotropy.

Targets are available in planar or customized geometries, with optional metallic backing plates to improve thermal conductivity and mechanical stability during high-power sputtering. Strict control of impurity levels is maintained to support research-grade and pilot-scale production requirements.

Applications

Scandium Gallium Iron Oxide Sputtering Targets are used across a range of advanced research and industrial thin-film applications, including:

  • Functional oxide thin films for semiconductor and oxide electronics

  • Spintronic devices and magnetic oxide research

  • Magneto-optical coatings and sensors

  • Transparent or semi-conductive oxide layers

  • R&D for multiferroic and strongly correlated materials

  • Advanced academic and industrial materials research programs

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionSc–Ga–Fe–O (custom stoichiometry)Determines electrical & magnetic properties
Purity99.9% – 99.99%Reduces defects and contamination
Diameter25 – 300 mm (custom available)Compatible with most sputtering systems
Thickness3 – 6 mmInfluences sputtering stability
Density≥ 95% of theoreticalEnsures uniform sputter rate
BondingCopper or Titanium backingImproves heat dissipation & target life
Sputtering ModeRF sputtering (typical)Suitable for oxide materials

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Scandium Gallium Iron OxideTunable magnetic & electronic behaviorSpintronics, oxide electronics
Gallium Iron OxideStrong magnetic responseMagneto-optical devices
Scandium OxideStructural stabilizationDielectric and optical coatings
Iron OxideCost-effective magnetismSensors, catalysts

FAQ

QuestionAnswer
Can the composition be customized?Yes. Scandium, gallium, and iron ratios can be adjusted based on application needs.
Is the target suitable for RF sputtering?Yes. RF sputtering is recommended for stable oxide film deposition.
Are backing plates available?Copper or titanium backing plates can be supplied upon request.
What research fields commonly use this target?Semiconductor research, spintronics, functional oxides, and advanced materials R&D.
How is the target packaged?Vacuum-sealed with protective foam in export-grade cartons or wooden crates.

Packaging

Our Scandium Gallium Iron Oxide Sputtering Targets are carefully labeled and externally tagged for clear identification and quality traceability. Each target is vacuum-sealed and protected against moisture, contamination, and mechanical damage to ensure it arrives in optimal condition for immediate use.

Conclusion

Scandium Gallium Iron Oxide Sputtering Targets offer a versatile platform for depositing high-performance functional oxide films with precisely engineered magnetic and electronic properties. With reliable material quality, flexible customization options, and strict quality control, this target is well-suited for both cutting-edge research and advanced development projects.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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ScGaFeO₃ TRG Sc₀.₅Ga₀.₅FeO₃, Ø1″×3.18 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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