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Boron Sputtering Target

ST0005 Boron Sputtering Target, B

Chemical Formula: B
Catalog Number: ST0005
CAS Number: 7440-42-8
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Boron sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

Introduction

Boron Sputtering Targets (B) are essential materials in advanced thin film deposition processes where extreme hardness, thermal stability, and precise chemical control are required. As a lightweight metalloid with unique bonding characteristics, boron is widely used in semiconductor manufacturing, protective coatings, neutron detection, and research-driven thin film applications. Boron sputtering targets enable the direct deposition of boron-containing films with excellent uniformity and reproducibility.

Detailed Description

Boron sputtering targets are typically produced from high-purity boron powder through hot pressing or sintering under controlled conditions. Due to boron’s intrinsic hardness and brittleness, manufacturing requires precise control of particle size, temperature, and pressure to achieve sufficient density and mechanical integrity for stable sputtering performance.

Compared with metallic targets, elemental boron exhibits low electrical conductivity, which makes RF sputtering the preferred deposition method in most applications. Boron targets demonstrate consistent erosion behavior and allow accurate control over film composition, especially in applications where stoichiometry and impurity levels are critical.

High-purity boron targets help minimize contamination from oxygen, carbon, or metallic impurities, directly impacting film performance in semiconductor and optical systems. Targets can be supplied as monolithic discs or plates, or bonded to metallic backing plates (such as copper) to improve heat dissipation and reduce the risk of cracking during operation.

Applications

Boron Sputtering Targets are widely used in:

  • Semiconductor and microelectronics manufacturing

  • Boron-doped thin films for electronic devices

  • Hard and wear-resistant coatings

  • Neutron detection and nuclear research coatings

  • Diffusion barriers and passivation layers

  • Advanced research and development applications

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical SymbolBDefines elemental boron films
Purity99.5% – 99.99%Reduces contamination and defects
Crystal FormAmorphous / PolycrystallineInfluences sputtering behavior
Diameter25 – 300 mm (custom)Matches sputtering cathodes
Thickness3 – 6 mm (typical)Affects target lifetime
Sputtering ModeRF (preferred)Required due to low conductivity
Backing PlateCopper (optional)Enhances thermal stability

Comparison with Related Boron-Based Targets

MaterialKey AdvantageTypical Application
Boron (B)Pure boron filmsSemiconductor & research
Boron Carbide (B₄C)Extreme hardnessProtective coatings
Boron Nitride (BN)Electrical insulationDielectric thin films

FAQ

QuestionAnswer
Why is RF sputtering required for boron targets?Elemental boron has low electrical conductivity, making RF sputtering more stable.
Can boron targets be bonded to backing plates?Yes, bonding to copper backing plates is available.
Are custom sizes supported?Yes, diameter, thickness, and shape can be customized.
Is boron suitable for reactive sputtering?Yes, boron can be used in reactive processes depending on film requirements.
How is the target packaged?Vacuum-sealed with moisture protection and impact-resistant packaging.

Packaging

Our Boron Sputtering Targets are carefully cleaned, vacuum-sealed, and packaged using moisture-resistant materials to prevent oxidation and contamination. Each target is clearly labeled to ensure traceability and consistent quality control throughout storage and transportation.

Conclusion

Boron Sputtering Target (B) is a high-performance material for producing boron-based thin films with exceptional purity and stability. With customizable dimensions, high-density fabrication, and optional backing plates, boron targets provide reliable performance for semiconductor, protective coating, and advanced research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Boron Target 99.9% ø50.8×3mm Indium Bonded Cu B/Plate, Boron (B) Target 4N ø76.2×3.18mm, B target 4N Ø40×4.5 mm Best Purity Best Density, B TRG 2N5, Ø152×5 mm / Ø140×3 mm, Bonded to Ø152×4 mm Cu BP, 2 pcs

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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