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Cadmium Sputtering Target

ST0006 Cadmium Sputtering Target, Cd

Chemical Formula: Cd
Catalog Number: ST0006
CAS Number: 7440-43-9
Purity: >99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cadmium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

Introduction

Cadmium Sputtering Target (Cd) is a high-purity metallic target used in physical vapor deposition (PVD) systems for semiconductor, optoelectronic, and compound thin film applications. Cadmium plays a critical role in the fabrication of II–VI semiconductor materials, including CdTe and CdS, which are widely utilized in photovoltaic and detector technologies.

Due to cadmium’s relatively low melting point and good electrical conductivity, it is compatible with DC magnetron sputtering systems. High material purity and controlled microstructure are essential to ensure stable sputtering performance and reproducible thin film properties.

Detailed Description

Cadmium (Cd) is a soft, ductile metal with a melting point of approximately 321 °C and a density of ~8.65 g/cm³. For sputtering applications, cadmium targets are typically produced through vacuum melting and precision machining to achieve homogeneous composition and minimal impurity levels.

Available configurations include:

  • Planar disc targets (1″–12″ diameter or custom)

  • Rectangular targets

  • Rotary targets (upon request)

  • Bonded or unbonded configurations

Because cadmium has a relatively low melting point and thermal conductivity compared to refractory metals, bonding to a copper backing plate is often recommended for improved heat dissipation and mechanical stability during high-power sputtering.

Key characteristics include:

  • Stable sputtering rate under controlled power

  • Good film uniformity

  • High purity options (99.9% – 99.999%)

  • Compatibility with compound formation (e.g., CdTe, CdS)

Proper power ramp-up and cooling control are important to prevent thermal stress and deformation during operation.

Applications

Cadmium Sputtering Targets are widely used in:

  • CdTe thin film solar cells

  • Cadmium sulfide (CdS) buffer layers

  • Infrared and photodetector materials

  • Optoelectronic thin films

  • Semiconductor research and development

  • Compound II–VI material fabrication

In photovoltaic manufacturing, cadmium layers are often deposited as part of multi-layer thin film stacks.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical SymbolCdDefines elemental sputtering material
Purity99.9% – 99.999%Higher purity improves semiconductor performance
Diameter25 – 300 mm (custom)Matches sputtering cathode holders
Thickness3 – 10 mmInfluences target lifetime
Density~8.65 g/cm³Relevant for deposition rate calculation
BondingCopper backing recommendedEnhances heat dissipation & stability

Custom dimensions, shapes, and bonding options are available to fit specific sputtering systems.

Comparison with Related Semiconductor Targets

MaterialKey AdvantageTypical Application
Cadmium (Cd)Key II–VI semiconductor elementCdTe & CdS thin films
Zinc (Zn)Lower toxicity alternativeZnO & compound semiconductors
Tellurium (Te)Compound formation with CdCdTe photovoltaics
Sulfur (S)Forms CdSBuffer layers in solar cells

Cadmium is typically used in combination with tellurium or sulfur to form compound semiconductor thin films rather than as a standalone metallic layer.

FAQ

QuestionAnswer
Is copper backing required?It is strongly recommended for improved thermal management.
Is Cd compatible with DC sputtering?Yes, cadmium’s conductivity allows for DC magnetron sputtering.
Can ultra-high purity grades be supplied?Yes, up to 5N purity is available for semiconductor applications.
Are there handling considerations?Yes, cadmium requires proper industrial handling due to toxicity regulations.
Is customization available?Yes, size, thickness, and bonding configurations can be tailored.

Packaging

Our Cadmium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. Targets are carefully packaged in moisture-resistant and shock-protective materials to ensure safe storage and transportation.

Conclusion

Cadmium Sputtering Targets (Cd) provide a reliable source material for II–VI semiconductor thin films and photovoltaic applications. With controlled purity, customizable configurations, and stable sputtering performance, they support advanced optoelectronic and energy-related research and production.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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