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Iridium Sputtering Target

ST0022 Iridium Sputtering Target, Ir

Chemical Formula: Ir
Catalog Number: ST0022
CAS Number: 7439-88-5
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iridium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

 

Introduction

Iridium sputtering targets are premium precious-metal materials used for advanced thin-film deposition where extreme chemical stability, high melting point, and excellent electrical performance are required. As one of the most corrosion-resistant metals known, Iridium (Ir) is widely applied in microelectronics, catalysis, optics, and harsh-environment coatings, making it an essential material for both research and high-end industrial processes.

Detailed Description

Iridium is a platinum-group metal characterized by its exceptionally high melting point (~2446 °C), outstanding oxidation resistance, and remarkable chemical inertness. These properties allow iridium thin films to maintain structural and electrical stability even under aggressive sputtering conditions or elevated operating temperatures.

Our Iridium sputtering targets are manufactured from high-purity iridium using precision melting, forging, and machining processes to achieve dense microstructures and consistent composition. The targets exhibit excellent mechanical integrity and low impurity levels, ensuring stable sputtering rates and reproducible film properties.

Iridium targets are compatible with DC magnetron sputtering and RF sputtering systems, depending on system configuration. Planar disc targets are available in standard diameters, with optional bonding to copper backing plates to improve heat dissipation and minimize thermal stress during high-power operation. Custom sizes, thicknesses, and bonding solutions are available to meet specific equipment and application requirements.

Applications

Iridium sputtering targets are commonly used in demanding thin-film applications, including:

  • Microelectronics and semiconductor devices

  • Electrode layers for ferroelectric and capacitor structures

  • Hard, wear-resistant and corrosion-resistant coatings

  • Optical and reflective coatings

  • Catalytic and electrochemical thin films

  • Research and development in extreme-environment materials

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialIridium (Ir)Defines thermal & chemical stability
Purity99.9% – 99.99%Reduces contamination in thin films
Crystal StructureFCCEnsures predictable sputtering behavior
Diameter1″ – 4″ (custom available)Fits standard sputtering cathodes
Thickness2 – 6 mmAffects target lifetime
Density~22.56 g/cm³Indicates material compactness
Backing PlateOptional Cu / MoImproves heat transfer

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Iridium (Ir)Extreme corrosion & heat resistanceElectrodes, harsh environments
Platinum (Pt)Excellent chemical stabilitySensors, electrodes
Ruthenium (Ru)Good conductivity, hard filmsSemiconductor interconnects
Tantalum (Ta)Strong adhesionBarrier layers

FAQ

QuestionAnswer
Is iridium suitable for DC sputtering?Yes, iridium is conductive and commonly used with DC sputtering systems.
Are bonded targets available?Yes, copper-bonded targets are available for improved thermal performance.
Can custom sizes be supplied?Yes, diameter, thickness, and backing options can be customized.
What industries typically use iridium films?Semiconductor, optics, energy, and advanced materials research.

Packaging

Our Iridium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed and protected with shock-absorbing materials to prevent surface damage and contamination during storage and transportation.

Conclusion

Iridium sputtering targets deliver unmatched durability, chemical stability, and performance for advanced thin-film applications. With high purity, excellent density, and flexible customization options, Ir targets are a reliable choice for demanding research and industrial deposition environments.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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