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Iron Sputtering Target

ST0023 Iron Sputtering Target, Fe

Chemical Formula: Fe
Catalog Number: ST0023
CAS Number: 7439-89-6
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iron sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Iron (Fe) sputtering targets are widely used in thin film deposition for magnetic materials, structural coatings, and electronic applications. As a fundamental transition metal with strong ferromagnetic properties and good mechanical strength, iron plays a key role in both research and industrial coating processes. High-quality iron sputtering targets enable stable deposition, precise film composition, and reliable performance across a range of vacuum coating technologies.

Detailed Description

Iron sputtering targets are typically manufactured from high-purity iron through vacuum melting, forging, and precision machining processes to ensure uniform composition and dense microstructure. The purity of iron directly influences film conductivity, magnetic performance, and defect levels, making it critical for advanced applications such as magnetic storage and sensor devices.

Iron is a ferromagnetic material, which can influence plasma behavior during sputtering. As a result, magnetron sputtering of Fe targets often requires careful adjustment of magnetic field strength and power settings to maintain stable plasma conditions. High-density targets (typically ≥99% theoretical density) help improve sputtering efficiency, reduce arcing, and ensure consistent film growth.

Fe sputtering targets can be supplied in both bonded and unbonded configurations. Bonding to copper backing plates using indium or elastomer layers enhances thermal conductivity and prevents overheating during high-power deposition. Customized compositions, including ultra-high purity grades or alloyed forms (e.g., Fe-based alloys), are also available to meet specific application requirements.

Applications

Iron Sputtering Targets are extensively used in:

  • Magnetic Thin Films: For data storage, sensors, and spintronic devices
  • Semiconductor Processing: As adhesion or functional layers in integrated circuits
  • Protective Coatings: Wear-resistant and corrosion-resistant layers
  • Research & Development: Studies in magnetism, phase transitions, and material science
  • Energy Devices: Components in batteries and catalytic coatings

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialIron (Fe)Defines film composition
Purity99.9% – 99.99% (3N – 4N)Higher purity improves film quality
Density≥ 99% theoretical densityEnsures stable sputtering and low particle generation
Diameter25 – 300 mm (custom)Fits various sputtering systems
Thickness3 – 6 mmAffects deposition rate and target life
BondingUnbonded / Cu-backed (Indium/Elastomer)Enhances heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Iron (Fe)Strong ferromagnetism, cost-effectiveMagnetic films, sensors
Nickel (Ni)Corrosion resistance, stable magnetismMagnetic alloys, coatings
Cobalt (Co)High magnetic anisotropyHigh-density storage
FeCo AlloyHigh saturation magnetizationAdvanced magnetic devices

FAQ

QuestionAnswer
Is iron suitable for DC sputtering?Yes, iron is conductive and compatible with DC magnetron sputtering.
Does magnetism affect sputtering performance?Yes, iron’s ferromagnetism can influence plasma confinement, requiring optimized sputtering conditions.
Can the target be customized?Yes, dimensions, purity levels, and bonding configurations can be tailored.
What backing plates are available?Copper backing plates with indium or elastomer bonding are commonly used.
Which industries use iron sputtering targets?Semiconductor, data storage, energy, coatings, and research sectors.

Packaging

Our Iron Sputtering Target, Fe, is meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the target arrives in perfect condition.

Conclusion

Iron Sputtering Targets offer a reliable and cost-effective solution for depositing magnetic and functional thin films. With high purity, dense microstructure, and customizable configurations, they are suitable for a wide range of industrial and research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Ø1" × 1.59 mm, Iron, 4N, Ø1" × 1.60 mm, Iron, 3N, Ø1" × 3.18 mm, Iron, 3N, Ø1" × 3.18 mm, Iron, 3N5, Ø1" × 3.18 mm, Iron, 4N, Ø1" × 6.35 mm, Iron, 3N5, Ø2" × 1.40 mm, Iron, 3N5, Ø2" × 1.40 mm, Iron, 4N, Ø2" × 1.59 mm, Iron, 3N5, Ø2" × 1.59 mm, Iron, 4N, Ø2" × 1.60 mm, Iron, 3N, Ø2" × 3.18 mm, Iron, 3N, Ø2" × 3.18 mm, Iron, 3N5, Ø2" × 3.18 mm, Iron, 4N, Ø2" × 6.35 mm, Iron, 3N5, Ø2" × 6.35 mm, Iron, 4N, Ø3" × 1.59 mm, Iron, 3N5, Ø3" × 1.60 mm, Iron, 3N, Ø3" × 2.03 mm, Iron, 3N5, Ø3" × 2.54 mm, Iron, 3N5, Ø3" × 2.54 mm, Iron, 4N, Ø3" × 3.18 mm, Iron, 3N, Ø3" × 3.18 mm, Iron, 3N5, Ø3" × 3.18 mm, Iron, 4N, Ø3" × 6.35 mm, Iron, 4N, Ø4" × 2.54 mm, Iron, 3N5, Ø4" × 2.54 mm, Iron, 4N, Ø4" × 3.18 mm, Iron, 3N5

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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