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Lithium Sputtering Target

ST0026 Lithium Sputtering Target, Li

Chemical Formula: Li
Catalog Number: ST0026
CAS Number: 7439-93-2
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lithium Sputtering Targets (Li) are highly specialized materials used in thin film deposition for energy storage, solid-state batteries, advanced electronics, and cutting-edge research. As the lightest metallic element with exceptional electrochemical activity, lithium plays a vital role in next-generation functional films where ionic conductivity, interfacial control, and low atomic mass are critical.

Detailed Description

Lithium sputtering targets are manufactured from high-purity lithium metal under strictly controlled inert or vacuum environments. Due to lithium’s extreme reactivity with oxygen, nitrogen, and moisture, target fabrication, machining, and packaging require rigorous handling protocols to preserve chemical integrity and surface cleanliness.

Elemental lithium is soft, low-density, and highly reactive, which differentiates it significantly from conventional metallic sputtering targets. Targets are commonly supplied as bonded assemblies, where lithium is encapsulated or bonded to compatible backing plates to improve mechanical stability and heat dissipation during sputtering. This approach also minimizes deformation and surface degradation under plasma exposure.

Lithium targets are typically used in RF sputtering or carefully controlled low-power DC sputtering systems. Process parameters such as base pressure, gas purity, and power ramp-up are especially critical to ensure stable sputtering behavior and consistent film composition. When properly handled, lithium sputtering targets enable precise deposition of lithium-containing films without relying on complex reactive sputtering routes.

Applications

Lithium Sputtering Targets are widely used in:

  • Solid-state lithium battery research

  • Thin film lithium electrolytes and electrodes

  • Energy storage and conversion devices

  • Semiconductor and electronic materials R&D

  • Lithium-based compound thin films

  • Advanced materials science laboratories

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical SymbolLiDefines elemental lithium films
Purity99.9% – 99.99%Minimizes contamination and side reactions
FormDisc, plate, bonded targetEnsures mechanical stability
Diameter25 – 150 mm (custom)Matches laboratory sputtering systems
Thickness2 – 6 mm (typical)Affects target lifetime
Density~0.53 g/cm³Influences sputtering behavior
Sputtering ModeRF / low-power DCRequired due to material properties
Handling AtmosphereInert gas / vacuumPrevents oxidation and moisture uptake

Comparison with Related Lithium Materials

MaterialKey AdvantageTypical Application
Lithium (Li)Direct lithium film depositionSolid-state battery research
Lithium Oxide (Li₂O)Improved stabilityDielectric and electrolyte films
Lithium Fluoride (LiF)Wide bandgap, low lossOptical and protective coatings

FAQ

QuestionAnswer
Why is lithium sputtering more challenging than other metals?Lithium is extremely reactive with air and moisture, requiring inert handling and controlled sputtering conditions.
Are lithium targets supplied bonded?Yes, bonded configurations are recommended for stability and thermal control.
Is RF sputtering required?RF sputtering is commonly used, though low-power DC may be possible in specific systems.
Can target size be customized?Yes, dimensions and bonding options can be tailored.
How should lithium targets be stored?Vacuum-sealed or argon-filled packaging is required.

Packaging

Our Lithium Sputtering Targets are prepared, handled, and packaged entirely under inert or vacuum conditions. Each target is vacuum-sealed or argon-filled, clearly labeled, and protected with multilayer moisture-barrier packaging to ensure safe storage and transportation.

Conclusion

Lithium Sputtering Target (Li) is an essential material for advanced thin film research and energy-related applications. With high purity, controlled fabrication, and specialized packaging, lithium targets enable reliable deposition of lithium-based films for solid-state batteries and next-generation electronic materials.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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