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ST0031 Neodymium Sputtering Target, Nd

Chemical Formula: Nd
Catalog Number: ST0031
CAS Number: 7440-00-8
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Neodymium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Neodymium Sputtering Target

Introduction

Neodymium Sputtering Targets are essential materials for producing functional thin films used in advanced electronics, photonics, magnetic devices, and energy technologies. As a rare-earth element with strong magnetic behavior and unique optical responses, neodymium supports high-performance coatings that require precise composition control and consistent deposition characteristics.

Detailed Description

The Neodymium Sputtering Target is produced from high-purity neodymium metal refined through vacuum melting or powder metallurgy. Because neodymium readily oxidizes, the entire manufacturing process—from raw material preparation to final machining—is carried out in controlled environments to ensure stability and surface cleanliness.

The target exhibits a dense, uniform microstructure with minimized porosity, enabling smooth erosion under DC or RF sputtering. This enhances the consistency of thin-film composition and reduces particulate formation during deposition. For high-power sputtering systems, neodymium can be supplied with copper or titanium backing plates to improve heat transfer and maintain dimensional stability throughout long deposition cycles.

Neodymium thin films are valuable in optical modulation layers, magneto-optic coatings, catalytic surfaces, and magnetic multilayer structures used in next-generation data storage and spintronic devices.

Applications

Neodymium sputtering targets are widely used in:

  • Semiconductor processing – magnetic multilayers, memory components, integrated thin-film structures

  • Optical coatings – selective absorption coatings, IR filters, photonic devices

  • Magnetic thin films – sensors, actuators, micro-magnetics research

  • Energy systems – catalytic surfaces, specialized battery components

  • Display and photonic devices – optical isolators, wavelength control films

  • R&D laboratories – alloy development, rare-earth compound studies, advanced coating trials

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.5% – 99.95%High purity stabilizes optical and magnetic film performance
Diameter25 – 300 mm (custom)Compatible with most commercial sputtering systems
Thickness3 – 10 mmDetermines sputtering lifetime and deposition rate
BondingCu / Ti bonding plateImproves cooling efficiency and mechanical stability
Density≥ 98% theoreticalEnsures uniform erosion and reduces defects

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Neodymium (Nd)Strong magnetic response and optical effectsMagnetic multilayers, photonic coatings
Samarium (Sm)High thermal stabilityMagnetic sensors, energy devices
Dysprosium (Dy)Coercivity enhancementSpintronics, data storage
Aluminum (Al)Cost-effective, reflectiveGeneral coatings, optical layers

FAQ

QuestionAnswer
Can the target be customized?Yes. Purity, size, microstructure, and bonding options can be fully customized.
How do you package neodymium targets?Vacuum-sealed with desiccant, foam protection, and export-grade cartons or wooden crates.
Is neodymium difficult to sputter?It is reactive, but dense targets with proper bonding ensure stable sputtering.
Do you offer backing plates?Yes—copper, titanium, indium bonding, and elastomer bonding options are available.
Which industries use this target?Semiconductor fabrication, optics, magnetics, energy research, and academic R&D.

Packaging

Each Neodymium Sputtering Target is vacuum-sealed and clearly labeled. Protective layers and rigid external packaging prevent oxidation and mechanical damage during transportation. This ensures the target arrives in optimal condition for high-precision thin-film deposition.

Conclusion

With stable magnetic performance, strong reactivity control, and excellent deposition behavior, Neodymium Sputtering Targets offer reliable performance for semiconductor, optical, magnetic, and energy-related thin-film applications. Custom dimensions and bonding options are available to meet both R&D and production-scale requirements.

For detailed specifications or a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Nd 3N ø50.8*3.18mm, Nd 3N ø50.8*3mm, Nd target 3N ø10×1 mm (10 pcs), Nd target 3N ø50.8×3.18 mm, Nd target 2N5 Ø2"×3 mm, Bonded to 3 mm Cu BP, Nd target 99% Ø60×5 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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