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ST0037 Rhenium Sputtering Target, Re

Chemical Formula: Re
Catalog Number: ST0037
CAS Number: 7440-15-5
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Rhenium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Rhenium Sputtering Target Description

Rhenium

The rhenium sputtering target is a silvery gray material made from high-purity rhenium metal. Rhenium, symbolized as “Re,” derives its name from the Rhine River, which flows from the Swiss Alps to the North Sea. First mentioned in 1908 and observed by Masataka Ogawa, its isolation was later successfully completed by Ogawa. Rhenium has an atomic number of 75 and is situated in Period 6, Group 7 of the periodic table, within the d-block. Its relative atomic mass is 186.207 Daltons, with the number in brackets representing the measurement uncertainty.

Rhenium Sputtering Target Specification

Material TypeRhenium
SymbolRe
Color/AppearanceSilvery gray
Melting Point3180 °C
Density21.02 gm/cc
Thermal Conductivity0.480 W/cm/K @ 25 °C
Electrical Resistivity19.3 microhm-cm @ 20°C
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Rhenium Sputtering Target Applications

The rhenium sputtering target is used in a variety of applications, including:

  • Thin film deposition
  • Decoration
  • Semiconductor manufacturing
  • Displays
  • LED and photovoltaic devices
  • Functional coatings
  • Optical information storage
  • Glass coating for automotive and architectural glass
  • Optical communications

Other Applications of Rhenium

  • High-Temperature Superalloys: Rhenium is incorporated into superalloys used in jet engine parts to enhance performance at high temperatures.
  • Nickel-Based Superalloys: Adding rhenium to these alloys improves their creep strength, making them more durable under stress.
  • Filaments: Rhenium filaments are known for their stability and are used in photoflash lamps, ion gauges, and mass spectrometers.
  • Medical Uses: Radioactive isotopes of rhenium are utilized in the treatment of liver and pancreatic cancer, delivered through a bacterial host.

Rhenium Sputtering Target Packaging

Our rhenium sputtering targets are meticulously handled to prevent damage during storage and transportation, ensuring they retain their original high quality.

Get Contact

TFM offers Rhenium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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