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ST0047 Strontium Sputtering Target, Sr

Chemical Formula: Sr
Catalog Number: ST0047
CAS Number: 7440-24-6
Purity: 99.5%, 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Strontium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Strontium Sputtering Target Description

Strontium

The strontium sputtering target is a silvery material made from high-purity strontium metal. Strontium, symbolized as “Sr,” gets its name from Strontian, a small town in Scotland. It was first mentioned in 1787 and observed by W. Cruikshank, with its isolation later accomplished and announced by H. Davy. Strontium has an atomic number of 38, located in Period 5 and Group 2 of the periodic table, belonging to the s-block. The relative atomic mass of strontium is 87.62 Daltons, with the number in brackets indicating the measurement uncertainty.

Strontium Sputtering Target Specification

Material TypeStrontium
SymbolSr
Color/AppearanceSilvery White, Metallic
Melting Point769 °C
Density2.64 g/cc
Thermal Conductivity35 W/m.K
Coefficient of Thermal Expansion22.5 x 10-6/K
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Strontium Sputtering Target Application

The strontium sputtering target is primarily used for thin film deposition. Additionally, strontium has several other important applications:
  • Ferrite Magnets: Used in the production of ferrite magnets.
  • Zinc Refining: Plays a role in the refining of zinc.
  • Toothpaste: Strontium chloride hexahydrate is an ingredient in toothpaste designed for sensitive teeth.
  • Pyrotechnics: Volatile strontium salts produce a bright crimson flame and are commonly used in fireworks.
  • Nuclear Auxiliary Power (SNAP) Devices: The isotope Sr-90, with a half-life of 28 years, is used in SNAP systems.

Handling Notes

  • No Bonding Service Available: Currently, bonding services are not offered for strontium sputtering targets.
  • High Chemical Activity: Strontium is highly reactive when exposed to the environment. To prevent chemical reactions, it requires oil packaging and a clean procedure during handling and storage.

Get Contact

TFM offers Strontium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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