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ST0060 Aluminum Chromium Sputtering Target, Al/Cr

Chemical Formula: Al/Cr
Catalog Number: ST0060
CAS Number: 59195-63-0
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum Chromium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Aluminum Chromium (Al/Cr) sputtering targets are widely used for depositing high-performance thin films that require a balance of corrosion resistance, hardness, and thermal stability. By combining aluminum’s lightweight and oxidation resistance with chromium’s strength and wear resistance, Al/Cr alloys are particularly valuable in protective coatings, decorative finishes, and functional thin films across industrial and research applications.


Detailed Description

Aluminum Chromium sputtering targets are engineered as alloy or composite materials with controlled Al/Cr ratios to tailor film properties such as hardness, conductivity, and oxidation resistance. These targets are typically manufactured using vacuum melting, powder metallurgy, or hot isostatic pressing (HIP) to achieve high density and compositional uniformity.

Aluminum contributes excellent oxidation resistance by forming a stable oxide layer, which improves durability in harsh environments. Chromium enhances hardness, wear resistance, and corrosion resistance, making the resulting films suitable for demanding mechanical and chemical conditions. The synergy between these elements enables the deposition of coatings with improved adhesion and long-term stability.

Depending on application requirements, Al/Cr sputtering targets can be supplied as planar or rotatable targets. For high-power sputtering systems, bonding to copper backing plates via indium or elastomer bonding is commonly used to improve heat dissipation and prevent thermal stress.

Key features include:

  • Tunable Al/Cr composition for customized coating performance

  • High density and homogeneous microstructure for stable sputtering

  • Excellent oxidation and corrosion resistance

  • Enhanced hardness and wear resistance in deposited films

  • Compatibility with reactive sputtering (e.g., forming AlCrN coatings)


Applications

Aluminum Chromium sputtering targets are widely used in:

  • Hard coatings such as AlCrN for cutting tools and molds

  • Protective coatings for aerospace and automotive components

  • Decorative coatings with improved durability

  • Semiconductor and electronic thin films

  • Optical coatings requiring stable performance

  • Wear-resistant and corrosion-resistant industrial coatings


Technical Parameters

ParameterTypical Value / RangeImportance
CompositionAl/Cr (custom ratios)Determines coating hardness & resistance
Purity99.9% – 99.99%Reduces contamination
Density≥ 99% theoreticalEnsures stable sputtering
Diameter25 – 300 mm (custom)Fits sputtering systems
Thickness3 – 8 mmInfluences lifetime
BondingCopper backing (In / elastomer)Improves thermal conductivity
Process CompatibilityDC / RF / Reactive sputteringEnables AlCrN and similar coatings

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Aluminum Chromium (Al/Cr)Balanced hardness & oxidation resistanceHard coatings (AlCrN)
Aluminum (Al)Lightweight, good conductivityGeneral coatings
Chromium (Cr)High hardness, corrosion resistanceWear-resistant coatings
Titanium Aluminum (Ti/Al)High-temperature performanceAerospace coatings

FAQ

QuestionAnswer
Can the Al/Cr ratio be customized?Yes, compositions can be tailored based on coating performance requirements.
Is this target suitable for reactive sputtering?Yes, it is commonly used to produce AlCrN and similar coatings in nitrogen atmospheres.
What bonding options are available?Indium bonding and elastomer bonding with copper backing plates are typical options.
Which industries use Al/Cr targets most?Tooling, automotive, aerospace, and electronics industries.
How are the targets packaged?Vacuum-sealed with protective materials to prevent oxidation and damage.

Packaging

Our Aluminum Chromium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.


Conclusion

Aluminum Chromium sputtering targets offer a robust solution for depositing durable, high-performance coatings with excellent resistance to wear, oxidation, and corrosion. With flexible composition design and reliable manufacturing quality, they are ideal for both industrial coating applications and advanced research.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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