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Chromium Vanadium Sputtering Target

ST0076 Chromium Vanadium Sputtering Target, Cr/V

Chemical Formula: Cr/V
Catalog Number: ST0076
CAS Number: 7440-47-3 | 7440
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Chromium Vanadium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Chromium Vanadium Sputtering Target (Cr/V)

Introduction

Chromium Vanadium (Cr/V) Sputtering Target is a versatile alloy material designed for depositing functional thin films that combine chromium’s hardness and corrosion resistance with vanadium’s strengthening and grain-refining effects. Cr/V alloy coatings are widely used in protective, decorative, and electronic applications where enhanced wear resistance, adhesion, and mechanical stability are required. As a sputtering target, Cr/V enables precise control of alloy composition and thin film performance.

Detailed Description

Our Chromium Vanadium Sputtering Targets are produced from carefully alloyed raw materials using vacuum melting or powder metallurgy techniques to ensure compositional uniformity and structural integrity. The Cr-to-V ratio can be customized to tailor hardness, stress behavior, electrical conductivity, and oxidation resistance in the deposited films.

High-density targets with homogeneous microstructure minimize particle generation and arcing during sputtering, providing stable plasma conditions and consistent deposition rates. Due to their metallic conductivity, Cr/V targets are typically compatible with DC sputtering systems, although RF sputtering can also be used depending on system configuration. Targets are available in circular, rectangular, or rotary configurations, with optional bonding to copper backing plates for improved heat dissipation and mechanical stability in high-power applications.

Applications

Chromium Vanadium Sputtering Targets are widely used in:

  • Wear-resistant and hard protective coatings

  • Decorative coatings with enhanced durability

  • Thin films for tools and mechanical components

  • Corrosion-resistant surface layers

  • Functional coatings in electronics and microfabrication

  • Research on Cr-based alloy thin films

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionCr/V alloy (custom ratios)Controls hardness and corrosion resistance
Purity99.9% – 99.99%Reduces impurity-related defects
Diameter25 – 300 mm (custom available)Compatible with standard sputtering cathodes
Thickness3 – 10 mmInfluences target lifetime
Density≥ 99% theoreticalImproves plasma stability
Sputtering ModeDC / RF sputteringSuitable for conductive alloys
BondingUnbonded / Cu backing (optional)Enhances thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Cr/VBalanced hardness and toughnessProtective alloy coatings
Pure ChromiumExcellent corrosion resistanceDecorative & protective films
Pure VanadiumStrengthening elementAlloy modification
Cr/N coatingsHigh hardnessCutting tools & wear layers

FAQ

QuestionAnswer
Can the Cr/V composition be customized?Yes, alloy ratios can be tailored to specific performance requirements.
Is DC sputtering suitable?Yes, Cr/V is conductive and compatible with DC sputtering systems.
Are bonded targets available?Yes, copper backing plates are available for improved heat dissipation.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or crates.

Packaging

Our Chromium Vanadium Sputtering Targets are carefully labeled and vacuum-sealed to ensure traceability and protection from oxidation or contamination. Export-grade packaging safeguards the targets during storage and international transport.

Conclusion

Chromium Vanadium (Cr/V) Sputtering Target offers a dependable solution for depositing durable alloy thin films with enhanced hardness, corrosion resistance, and mechanical stability. With precise composition control, high density, and customizable formats, it is well suited for advanced protective coatings and functional thin film applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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