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Zinc Tin Sputtering Target

ST0124 Zinc Tin Sputtering Target, Zn/Sn

Chemical Formula: Zn/Sn
Catalog Number: ST0124
CAS Number: 7440-66-6 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Tin sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

Introduction

Zinc Tin Sputtering Targets (Zn/Sn) are alloy targets widely used for depositing functional thin films in optoelectronics, transparent electronics, and energy-related applications. By combining zinc and tin in controlled ratios, Zn/Sn targets enable precise tuning of electrical conductivity, optical transparency, and carrier concentration. They are especially valued as precursor materials for zinc–tin–oxide–based films, offering stable sputtering behavior and excellent process flexibility for both R&D and industrial production.

Detailed Description

Zn/Sn sputtering targets are produced from high-purity zinc and tin raw materials using advanced alloying and consolidation techniques. Careful control of composition homogeneity and microstructure ensures consistent sputtering rates and minimizes compositional drift during deposition. Depending on system requirements, targets can be manufactured as monolithic alloy discs or bonded to backing plates to enhance thermal management and mechanical stability.

Compared with single-element zinc or tin targets, Zn/Sn alloy targets provide improved control over film stoichiometry without relying entirely on reactive gas tuning. This simplifies process windows and improves repeatability—particularly important for large-area coatings and multi-batch production.

Zn/Sn targets are compatible with DC magnetron sputtering due to their metallic conductivity, and they can also be used in reactive sputtering environments with oxygen to form zinc–tin oxide (ZTO) thin films with tailored electronic properties.

Applications

Zinc Tin sputtering targets are commonly used in:

  • Transparent oxide semiconductors: Precursors for zinc–tin oxide (ZTO) thin films

  • Thin-film transistors (TFTs): Channel and functional layers in display backplanes

  • Optoelectronics: Transparent and semiconducting layers

  • Photovoltaics: Buffer and functional layers

  • Sensors: Gas and environmental sensing coatings

  • Research & development: Composition-tunable oxide electronics

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionZn/Sn (custom atomic ratios)Controls electrical & optical properties
Purity99.9% – 99.99%Reduces impurities and defects
Diameter25 – 300 mm (custom)Fits standard sputtering cathodes
Thickness3 – 6 mm (typical)Influences target lifetime
Density≥ 95% of theoreticalEnsures stable sputtering
Sputtering ModeDC / Reactive DCSuitable for metallic alloy targets
BondingCopper / Titanium backing (optional)Improves heat dissipation

Comparison with Related Targets

MaterialKey AdvantageTypical Application
Zn/SnTunable composition, stable sputteringZTO and oxide electronics
ZnHigh transparency (as oxide)Transparent coatings
SnGood conductivityFunctional metal films
In-based alloysHigh performance, higher costAdvanced TCOs

FAQ

QuestionAnswer
Can the Zn/Sn ratio be customized?Yes, atomic or weight ratios can be tailored to your process.
Is DC sputtering suitable?Yes, Zn/Sn alloy targets are conductive and ideal for DC sputtering.
Can these targets be used for oxide films?Yes, reactive sputtering with oxygen is commonly used to form ZTO films.
How are the targets packaged?Vacuum-sealed with protective cushioning for safe transport.

Packaging

Our Zinc Tin Sputtering Targets (Zn/Sn) are clearly labeled and vacuum-sealed to ensure traceability and strict quality control. Each target is protected with reinforced cushioning and export-grade packaging to prevent oxidation, contamination, or mechanical damage during storage and transportation.

Conclusion

Zinc Tin Sputtering Targets (Zn/Sn) provide a flexible and reliable solution for depositing composition-controlled thin films in transparent and oxide electronics. With customizable alloy ratios, stable sputtering performance, and consistent quality, Zn/Sn targets are well suited for both advanced research and scalable industrial thin-film production.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Related Product: Zinc (Zn) Sputtering Target, Tin (Sn) Sputtering Target

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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