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ST0124 Zinc Tin Sputtering Target, Zn/Sn

Chemical Formula: Zn/Sn
Catalog Number: ST0124
CAS Number: 7440-66-6 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Tin sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

MSDS File

Introduction

Zinc Tin Sputtering Targets, meticulously crafted by TFM, are essential for the fabrication of thin films used in various high-tech industries. These targets are engineered to deliver exceptional performance in semiconductor manufacturing, photovoltaics, and optical applications. Recognizing the critical role of sputtering targets in these processes highlights the importance of our high-purity materials in advancing technology.

Related Product: Zinc (Zn) Sputtering Target, Tin (Sn) Sputtering Target

ZincTin

Product Description

Specifications:

Material Composition: Zinc (Zn) and Tin (Sn)

Purity: Up to 99.9%

Forms Available:

  • Circular Targets: Diameter up to 14 inches, Thickness minimum 1mm
  • Rectangular Targets: Length up to 32 inches, Width up to 12 inches, Thickness minimum 1mm

Customization: Custom sizes and compositions available upon request.

Applications

Our Zinc Tin Sputtering Targets play a crucial role in a variety of high-tech applications:

  • Semiconductor Device Fabrication: They significantly improve the performance and longevity of semiconductor components.
  • Thin Film Deposition for Photovoltaics: These targets are essential for enhancing the efficiency of solar panels.
  • Display Technology: Employed in the production of screens for smartphones, tablets, and televisions.
  • Optical Coatings: Vital for creating anti-reflective coatings on glasses and other optical devices.

Manufacturing and Quality Assurance

Manufacturing Process:

  • Refining: We use a three-layer electrolytic process to achieve high purity.
  • Melting and Casting: This is conducted in an electrical resistance furnace with semi-continuous casting to ensure consistent quality.
  • Grain Refinement: Thermomechanical treatment is applied to enhance performance.

Quality Assurance:

Each batch of our Zinc Tin Sputtering Targets undergoes stringent testing to verify composition and purity. We adhere to ISO standards to ensure that every product meets rigorous quality criteria.

Packaging and Shipping

Our Zinc Tin Sputtering Targets are carefully packaged to ensure they remain undamaged during transit. Each target is securely vacuum-sealed in plastic and cushioned with foam for additional protection. Every shipment is accompanied by important documentation, such as packing lists and analytical reports, including Certificates of Analysis, to ensure full traceability and quality assurance.

Pricing and Ordering

Please reach out to us to obtain detailed pricing information and discuss your specific requirements. We provide competitive rates and adaptable order sizes to cater to both research and industrial uses.

Frequently Asked Questions (FAQ)

Q1: What are the key advantages of utilizing Zinc Tin Sputtering Targets?

A1: Zinc Tin Sputtering Targets are prized for their superior film uniformity and high purity, essential for crafting top-quality thin films used in various technological advancements.

Q2: What are the best practices for storing and handling the targets after delivery?

A2: Keep the targets in a dry, clean environment away from any direct exposure to sunlight. It is crucial to handle them carefully to prevent any contamination of the surfaces.

Q3: Is it possible to request samples before committing to a large order?

A3: Absolutely, we offer sample targets for testing to confirm that our products meet your precise needs before proceeding with a substantial order.

Q4: What precautions should be taken when employing Zinc Tin Sputtering Targets?

A4: Make sure the sputtering apparatus is correctly set up and the target is installed following the manufacturer’s guidelines. Proper safety equipment should always be used when handling the targets.

Contact Us

TFM offers Zinc Tin Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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