Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Tungsten Oxide Sputtering Target

ST0199 Tungsten Oxide Sputtering Target, WO3

Chemical Formula: WO3
Catalog Number: ST0199
CAS Number: 1314-35-8
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Tungsten Oxide Sputtering Targets are ceramic deposition materials widely used for producing functional oxide thin films with electrochromic, optical, and electronic properties. Tungsten oxide—most commonly in the form of WO₃—is valued for its tunable bandgap, high chemical stability, and reversible ion insertion behavior, making it a key material in smart windows, sensors, and energy-related thin film technologies.

Detailed Description

Tungsten oxide sputtering targets are manufactured from high-purity tungsten oxide powders through controlled powder processing, pressing, and high-temperature sintering. These processes ensure high target density, uniform microstructure, and stable stoichiometry, all of which are critical for consistent sputtering rates and reproducible film properties.

As an insulating ceramic material, tungsten oxide targets are typically used with RF magnetron sputtering systems. For applications requiring higher power densities or improved thermal management, targets can be supplied bonded to metallic backing plates (such as copper or titanium) to enhance heat dissipation and reduce the risk of cracking during deposition.

Careful control of phase composition (e.g., WO₃ or sub-stoichiometric WOₓ) allows tuning of electrical conductivity, optical absorption, and electrochromic response in the deposited films.

Applications

  • Electrochromic coatings for smart windows

  • Gas sensing and environmental monitoring films

  • Optical and antireflective coatings

  • Energy storage and battery-related thin films

  • Semiconductor and functional oxide research

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialTungsten Oxide (WO₃ / WOₓ)Functional oxide ceramic
Purity99.9% – 99.99%Impacts optical & electrical performance
Target FormDisc / Plate (bonded or unbonded)Compatible with sputtering systems
Diameter25 – 300 mm (custom)Fits standard magnetron cathodes
Thickness3 – 6 mm (typical)Influences target lifetime
Sputtering ModeRF magnetron sputteringRequired for insulating oxides
Backing PlateCopper / Titanium (optional)Improves thermal management

Comparison with Related Oxide Targets

MaterialKey AdvantageTypical Application
Tungsten Oxide (WO₃)Electrochromic & optical functionalitySmart windows & sensors
Molybdenum Oxide (MoO₃)High work functionElectronics & optics
Vanadium Oxide (VO₂)Thermochromic behaviorSmart coatings

FAQ

QuestionAnswer
Is RF sputtering required for tungsten oxide targets?Yes, RF magnetron sputtering is typically used for WO₃ targets.
Can the stoichiometry be customized?Yes, WO₃ or sub-stoichiometric WOₓ compositions can be supplied.
Are bonded targets available?Yes, copper- or titanium-backed targets are available upon request.
Can large-area targets be produced?Yes, targets up to 300 mm or larger can be manufactured.
Is a Certificate of Analysis provided?Yes, CoA is available upon request.

Packaging

Our Tungsten Oxide Sputtering Targets are carefully labeled and vacuum-sealed or inert-gas packed to prevent contamination and moisture uptake. Shock-absorbing materials and export-grade cartons or wooden crates ensure safe transportation and storage.

Conclusion

Tungsten Oxide Sputtering Targets deliver reliable composition control, stable sputtering performance, and excellent functional properties for advanced oxide thin film deposition. With flexible customization options and strict quality control, they are an ideal choice for electrochromic, optical, and energy-related PVD applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

WO₃ Target ≥99.5% ø50.8*3.18mm Indium Bonded to 2.0mm Cu B/Plate, WO3 target 3N/4N ø50.8×6.35mm

Reviews

There are no reviews yet.

Be the first to review “ST0199 Tungsten Oxide Sputtering Target, WO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top