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ST0200 Vanadium Oxide Sputtering Target, V2O5

Chemical Formula: V2O5
Catalog Number: ST0200
CAS Number: 1314-62-1
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Vanadium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Vanadium Oxide Sputtering Target Description

Introduction

Vanadium Oxide (V₂O₅) Sputtering Target is a functional transition-metal oxide widely used in electrochromic devices, energy storage systems, and advanced optical coatings. Owing to its layered crystal structure and variable oxidation states, V₂O₅ enables thin films with tunable electrical conductivity, optical transmittance, and ion-intercalation behavior. As a sputtering target, V₂O₅ provides a reliable route for depositing uniform vanadium oxide thin films for both research and industrial applications.

Detailed Description

Our Vanadium Oxide Sputtering Targets are fabricated from high-purity V₂O₅ ceramic materials with carefully controlled stoichiometry. Precise control of oxygen content is critical, as it directly influences film phase, electrochemical activity, and optical properties. The targets are produced through optimized powder processing, calcination, and sintering to achieve high density and uniform microstructure.

A dense ceramic body minimizes particle generation and improves plasma stability during sputtering, which is essential for reproducible thin film deposition. V₂O₅ targets are typically used in RF sputtering systems and can be supplied in standard round or rectangular geometries. For higher power operation or improved thermal management, bonding to copper or titanium backing plates is available upon request.

Applications

Vanadium Oxide (V₂O₅) Sputtering Targets are commonly used in the following thin film applications:

  • Electrochromic coatings for smart windows and displays

  • Cathode and functional layers in lithium-ion and solid-state batteries

  • Thin films for sensors and switching devices

  • Optical coatings with tunable absorption

  • Thin film transistors and oxide electronics research

  • Academic and industrial R&D on vanadium-based oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionV₂O₅Determines electrochemical and optical behavior
Purity99.9% – 99.99%Reduces defect-related performance loss
Diameter25 – 200 mm (custom available)Compatible with standard sputtering cathodes
Thickness3 – 6 mmAffects target lifetime
Density≥ 95% theoreticalImproves plasma stability
Sputtering ModeRF sputteringRequired for ceramic oxides
BondingUnbonded / Cu or Ti backing (optional)Enhances heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
V₂O₅Strong electrochromic and ion-intercalation behaviorSmart windows & batteries
VO₂Thermochromic phase transitionSmart coatings
TiO₂Chemical stabilityOptical & protective coatings
WO₃Mature electrochromic materialElectrochromic devices

FAQ

QuestionAnswer
Can the V₂O₅ target size be customized?Yes, diameter, thickness, and shape can be tailored to your system.
Is RF sputtering required for V₂O₅?Yes, V₂O₅ is a ceramic oxide and typically requires RF sputtering.
Are bonded targets available?Yes, copper or titanium backing plates are available on request.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or crates.

Packaging

Our Vanadium Oxide Sputtering Targets are meticulously tagged and vacuum-sealed to ensure traceability and protection from moisture and contamination. Robust export-grade packaging is used to prevent damage during storage and international transportation.

Conclusion

Vanadium Oxide (V₂O₅) Sputtering Target offers a dependable solution for depositing high-quality vanadium oxide thin films with electrochromic, optical, and electrochemical functionality. With high purity, controlled stoichiometry, and flexible customization options, it is well suited for advanced energy devices, smart coatings, and thin film research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

V₂O₅ target 4N ø50.8×3.18mm, V2O5 TRG Ø101×6×3.2 mm, Cu BP, V2O5 TRG Ø102×3.2 mm, Cu BP, V2O5 TRG Ø120×6 mm, Cu BP

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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