Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Vanadium Nitride Sputtering Target

ST0218 Vanadium Nitride Sputtering Target, VN

Chemical Formula: VN
Catalog Number: ST0218
CAS Number: 24646-85-3
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Vanadium Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Vanadium Nitride Sputtering Target (VN) is a high-performance ceramic target used in physical vapor deposition (PVD) to create hard, wear-resistant, and electrically conductive nitride coatings. VN films are valued for their high hardness, excellent thermal stability, good electrical conductivity, and corrosion resistance, making them suitable for demanding industrial and research applications. VN sputtering targets are widely adopted in surface engineering, microelectronics, and advanced coating development.

Detailed Description

Vanadium Nitride sputtering targets are manufactured from high-purity vanadium and nitrogen sources through controlled nitridation, powder processing, and high-density sintering. The resulting ceramic targets exhibit uniform stoichiometry, fine microstructure, and high density, which are essential for stable sputtering rates and consistent film composition.

Compared with metallic vanadium targets used in reactive sputtering, pre-nitrided VN targets offer improved process stability and reproducibility, especially for applications requiring precise nitrogen content. VN coatings deposited by magnetron sputtering typically demonstrate low friction coefficients, strong adhesion to substrates, and excellent resistance to oxidation at elevated temperatures.

VN sputtering targets are compatible with RF magnetron sputtering systems and can be supplied as monolithic discs or bonded to metallic backing plates to enhance thermal management during higher-power operation.

Applications

Vanadium Nitride sputtering targets are commonly used in:

  • Hard and wear-resistant coatings for tools and components

  • Decorative and functional PVD coatings

  • Diffusion barrier and conductive nitride layers

  • Microelectronics and semiconductor research

  • Tribological and low-friction surface coatings

  • Advanced materials and thin-film R&D

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaVNDefines nitride functionality
Purity99.5% – 99.99%Improves coating performance
Target Diameter25 – 300 mm (custom)Fits standard sputtering systems
Thickness3 – 6 mm (custom available)Influences sputtering stability
Density≥ 95% of theoreticalEnsures uniform erosion
Backing PlateOptional (Cu / Ti)Improves heat dissipation
Deposition MethodRF Magnetron SputteringSuitable for ceramic targets

Comparison with Related Nitride Targets

MaterialKey AdvantageTypical Application
Vanadium Nitride (VN)Hard, conductive nitrideWear-resistant coatings
Titanium Nitride (TiN)Gold-colored, high hardnessDecorative & tool coatings
Chromium Nitride (CrN)Corrosion resistanceProtective coatings
Niobium Nitride (NbN)Superconducting propertiesElectronics & research

FAQ

QuestionAnswer
Is VN suitable for high-temperature applications?Yes, VN coatings maintain stability and hardness at elevated temperatures.
Is RF sputtering required?RF sputtering is recommended due to the ceramic nature of VN.
Can target sizes be customized?Yes, diameter, thickness, and bonding options are available.
Is VN electrically conductive?Yes, VN exhibits good electrical conductivity compared with many nitrides.
How is the target packaged?Vacuum-sealed with protective cushioning to prevent contamination.

Packaging

Our Vanadium Nitride Sputtering Targets are carefully vacuum-sealed and externally labeled to ensure accurate identification and strict quality control. Moisture-resistant wrapping and shock-absorbing packaging are used to protect the target during storage and international transportation.

Conclusion

The Vanadium Nitride Sputtering Target (VN) is a reliable solution for depositing hard, conductive, and wear-resistant nitride thin films. With stable sputtering behavior, customizable dimensions, and consistent material quality, VN targets are well suited for advanced PVD coatings, semiconductor research, and industrial surface engineering.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Reviews

There are no reviews yet.

Be the first to review “ST0218 Vanadium Nitride Sputtering Target, VN”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top