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Vanadium Nitride Sputtering Target

ST0218 Vanadium Nitride Sputtering Target, VN

Chemical Formula: VN
Catalog Number: ST0218
CAS Number: 24646-85-3
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Vanadium Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Vanadium Nitride Sputtering Target Description

Vanadium Nitride sputtering target from TFM is a nitride ceramic sputtering material with the chemical formula VN.

Vanadium is a chemical element named after Vanadis, an old Norse name for the Scandinavian goddess Freyja. It was first identified in 1801 by M. del Río and later isolated by N.G. Sefström. The element’s symbol is “V,” and it is positioned in Period 4, Group 5 of the periodic table, within the d-block. Vanadium has an atomic number of 23 and a relative atomic mass of 50.9415(1) Dalton, where the number in parentheses indicates the measurement uncertainty.

Related Product: Vanadium Sputtering Target

NitrogenNitrogen is a chemical element whose name comes from the Greek words ‘nitron’ and ‘genes,’ meaning nitre-forming. It was first identified and observed by Daniel Rutherford in 1772. The element’s chemical symbol is “N,” and it is located in Period 2, Group 15 of the periodic table, part of the p-block. Nitrogen has an atomic number of 7, and its relative atomic mass is 14.0067(2) Dalton, with the number in brackets indicating the uncertainty in this measurement.

Vanadium Nitride Sputtering Target Specification

Material TypeVanadium Nitride
SymbolVN
Color/AppearanceBlack
Density6.13 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Vanadium Nitride Sputtering Target Application

The vanadium nitride sputtering target is utilized in various applications, including thin film deposition, decoration, and the semiconductor industry. It’s also widely used in displays, LED, and photovoltaic devices. Additionally, vanadium nitride serves as a functional coating in optical information storage industries and is employed in glass coating applications, such as for car glass, architectural glass, and optical communication systems.

Vanadium Nitride Sputtering Target Packaging

Our vanadium nitride sputtering target is meticulously tagged and labeled externally to ensure easy identification and maintain strict quality control standards. We take great care in handling and packaging to prevent any damage that might occur during storage or transportation, ensuring the product arrives in pristine condition.

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TFM offers Vanadium Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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