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ST0223 Hafnium Carbide Sputtering Target, HfC

Chemical Formula: HfC
Catalog Number: ST0223
CAS Number: 12069-85-1
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Hafnium Carbide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Availability: 99 in stock

Hafnium Carbide Sputtering Target Description

Hafnium is a lustrous, silvery-gray transition metal known for its strong resemblance to zirconium, often found in zirconium minerals. Predicted by Dmitri Mendeleev in 1869, hafnium was identified much later, in 1923, by Dirk Coster and George de Hevesy, marking it as the last stable element to be discovered. The element is named after “Hafnia,” the Latin name for Copenhagen, where it was discovered. Hafnium is characterized by its high melting point, corrosion resistance, and use in nuclear reactors and high-temperature alloys.

Hafnium

Related Product: Hafnium Sputtering Target

CarbonCarbon is a fundamental chemical element, symbolized by “C,” with its name derived from the Latin word ‘carbo,’ meaning charcoal. Known and utilized as early as 3750 BC by ancient Egyptians and Sumerians, carbon is essential in many aspects of life and technology. It has an atomic number of 6, placing it in Period 2 and Group 14 of the periodic table, within the p-block. The relative atomic mass of carbon is approximately 12.0107, with a slight uncertainty indicated by the number in parentheses. Carbon’s versatility and unique chemical properties make it a crucial component in organic chemistry, materials science, and various industrial applications.

Hafnium Carbide Sputtering Target Specification

Compound FormulaHfC
Molecular Weight190.5
AppearanceBlack
Melting Point3,900° C
Boiling PointN/A
Density12.20 g/cm3

Hafnium Carbide Sputtering Target Application

The hafnium carbide sputtering target is widely utilized in various applications, including thin film deposition, decoration, and the semiconductor industry. It is also used in displays, LEDs, and photovoltaic devices. Additionally, it plays a significant role in functional coatings and the optical information storage industry. The material is commonly applied in glass coating, such as for car and architectural glass, as well as in optical communication technologies. Its versatility and durability make it a valuable component in these high-performance applications.

Hafnium Carbide Sputtering Target Packaging

Our hafnium carbide sputtering targets are meticulously tagged and labeled externally to ensure clear identification and effective quality control. We take great care in handling and packaging these targets to prevent any potential damage during storage or transportation, thereby maintaining the quality and integrity of the product throughout the process.

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TFM offers Hafnium Carbide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
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99.5% Purity,Dia.38.1*3.00mm (+/-0.1mm)

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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