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ST0225 Molybdenum Carbide Sputtering Target, Mo2C

Chemical Formula: Mo2C
Catalog Number: ST0225
CAS Number: 12069-89-5
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum Carbide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Molybdenum Carbide Sputtering Target (Mo₂C) is a high-performance ceramic target widely used in thin film deposition processes for advanced coatings and functional materials. Known for its exceptional hardness, high melting point, and chemical stability, molybdenum carbide plays an important role in applications that require wear resistance, electrical conductivity, and thermal stability.

Mo₂C thin films are increasingly used in semiconductor devices, protective coatings, catalysis-related research, and energy technologies. Through magnetron sputtering or other physical vapor deposition (PVD) techniques, Mo₂C targets enable the formation of dense, uniform coatings with excellent adhesion and durability.

Detailed Description

Molybdenum carbide sputtering targets are typically manufactured using high-purity molybdenum and carbon sources through powder metallurgy or hot pressing techniques. These processes allow the formation of a dense ceramic target with controlled stoichiometry and minimal porosity, which is essential for stable sputtering performance.

Mo₂C is a refractory compound with a melting point exceeding 2600 °C and exhibits a combination of metal-like electrical conductivity and ceramic-like hardness. This hybrid property makes it particularly valuable in thin film engineering where both electrical performance and mechanical durability are required.

During sputtering deposition, Mo₂C targets can produce carbide coatings that demonstrate excellent resistance to wear, corrosion, and high-temperature oxidation. The deposited films often show strong adhesion to metallic, ceramic, and semiconductor substrates.

Another advantage of molybdenum carbide thin films is their catalytic activity. Mo₂C has been widely studied as a catalyst or catalyst-support material due to its electronic structure, which resembles noble metals in certain reactions. This makes Mo₂C coatings attractive for hydrogen evolution reactions (HER), fuel cell technologies, and advanced catalytic systems.

For high-power sputtering systems, Mo₂C targets may be supplied as monolithic targets or bonded to copper backing plates to improve heat dissipation and mechanical stability during deposition.

Applications

Molybdenum Carbide sputtering targets are widely used across multiple high-technology sectors:

  • Hard protective coatings for cutting tools and wear-resistant surfaces

  • Semiconductor thin films used in advanced microelectronics

  • Catalytic coatings for hydrogen evolution and energy conversion technologies

  • Diffusion barrier layers in microelectronic devices

  • High-temperature coatings for aerospace and industrial equipment

  • Research applications in nanostructured carbides and advanced functional materials

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.5% – 99.9%Higher purity reduces contamination in thin films
Chemical FormulaMo₂CDetermines carbide structure and electrical behavior
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 6 mmInfluences sputtering efficiency and target life
Density≥ 95% theoretical densityEnsures stable sputtering and uniform film deposition
BondingCopper backing plate / Indium bondedImproves heat transfer during high-power sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Molybdenum Carbide (Mo₂C)High hardness with metallic conductivityWear-resistant and catalytic coatings
Tungsten Carbide (WC)Extremely high hardnessCutting tool coatings
Molybdenum (Mo)Excellent thermal stability and conductivitySemiconductor and barrier layers

FAQ

QuestionAnswer
Can the Mo₂C sputtering target be customized?Yes. Diameter, thickness, and bonding configurations can be customized to match specific sputtering systems.
What sputtering methods are compatible with Mo₂C targets?Mo₂C targets can be used in DC magnetron sputtering, RF sputtering, and other PVD deposition techniques.
Are bonded targets available?Yes. Copper backing plates with indium bonding are commonly used to enhance thermal conductivity and mechanical stability.
What purity levels are typically available?Standard purities range from 99.5% to 99.9%, depending on the deposition requirements.
What substrates can Mo₂C films be deposited on?Mo₂C coatings can be deposited on metals, ceramics, silicon wafers, and glass substrates.

Packaging

Our Molybdenum Carbide Sputtering Target (Mo₂C) products are carefully tagged and labeled externally to ensure accurate identification and strict quality control. Each target is securely packaged using vacuum-sealed bags, protective foam, and export-grade cartons or wooden crates. These packaging measures prevent contamination, oxidation, and mechanical damage during storage and transportation.

Conclusion

The Molybdenum Carbide Sputtering Target (Mo₂C) is an excellent material for producing durable, high-performance thin films with superior hardness, chemical stability, and electrical conductivity. Its unique combination of ceramic strength and metallic properties makes it highly suitable for protective coatings, catalytic systems, and semiconductor applications.

With customizable dimensions, high-density manufacturing, and reliable deposition performance, Mo₂C sputtering targets provide an effective solution for advanced thin film technologies.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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