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Cesium Fluoride Sputtering Target

ST0238 Cesium Fluoride Sputtering Target, CsF

Chemical Formula: CsF
Catalog Number: ST0238
CAS Number: 13400-13-0
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cesium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Cesium Fluoride Sputtering Target

Introduction

Cesium Fluoride (CsF) Sputtering Target is a high-purity fluoride material widely used in thin film deposition for optoelectronic, optical, and semiconductor applications. With its wide bandgap, strong ionic bonding, and transparency across UV, visible, and IR ranges, CsF is particularly valuable in optical coatings, electron emission layers, and advanced research applications.

Detailed Description

The Cesium Fluoride Sputtering Target is manufactured from refined, high-purity CsF powder, consolidated through cold pressing and sintering or vacuum melting to achieve dense, uniform targets. The resulting material provides stable sputtering performance and high-quality thin films with low contamination levels.

  • Chemical Formula: CsF

  • Purity: Available in 99.9% (3N) and 99.99% (4N) grades.

  • Appearance: White crystalline solid, hygroscopic in nature (requires careful storage and handling).

  • Shapes & Sizes: Circular (25–300 mm), rectangular, and custom designs with thicknesses from 3–6 mm.

  • Bonding Options: Indium or elastomer bonding to copper/titanium backing plates for enhanced heat transfer and mechanical stability.

Applications

Cesium Fluoride sputtering targets are used in:

  • Optical Coatings – Anti-reflective and beam-splitting coatings in UV/IR devices.

  • Semiconductors & Electronics – Insulating and dielectric layers in thin film devices.

  • Photovoltaics – Electron emission and transport layers in solar cell technologies.

  • Research & Development – Advanced thin film studies in material science and photonics.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity ensures stable sputtering and film performance
Diameter25 – 300 mm (custom)Matches industry-standard sputtering systems
Thickness3 – 6 mmInfluences sputtering stability and deposition rate
BondingCopper / Titanium backingImproves thermal conductivity and structural stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Cesium Fluoride (CsF)Wide bandgap, high transparencyOptical & electronic coatings
Lithium Fluoride (LiF)High UV transmissionUV optics, AR coatings
Calcium Fluoride (CaF₂)High laser damage thresholdLaser optics, IR windows

FAQ

QuestionAnswer
Can CsF targets be customized?Yes, size, thickness, and bonding can be tailored for specific sputtering systems.
What is the standard lead time?Typically 2–3 weeks depending on specifications and order size.
Is CsF hygroscopic?Yes, it absorbs moisture and should be stored in a dry, vacuum-sealed environment.
How is it packaged?Vacuum-sealed with desiccants, cushioned with protective foam, and shipped in export-safe cartons or crates.
Which industries use CsF targets most?Optics, semiconductors, solar energy, and R&D laboratories.

Packaging

Cesium Fluoride Sputtering Targets are vacuum-sealed with moisture-proof barriers to prevent degradation during storage and transport. Each target is individually labeled and shipped in foam-protected, export-grade cartons or wooden crates for safe delivery.

Conclusion

Cesium Fluoride Sputtering Targets provide excellent transparency, high purity, and reliable sputtering performance, making them ideal for thin film deposition in optical, electronic, and photovoltaic applications. With customizable dimensions, purity levels, and bonding options, they are a dependable solution for both industrial production and advanced research.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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