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ST0265 Niobium Silicide Sputtering Target, NbSi2

Chemical Formula: NbSi2
Catalog Number: ST0265
CAS Number: 12060-34-3
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Niobium Silicide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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Niobium Silicide Sputtering Target

Introduction

The Niobium Silicide Sputtering Target (NbSi₂) is a specialized material engineered for thin film deposition, combining the refractory properties of niobium with the semiconducting and thermal stability characteristics of silicon. This target material is widely used in semiconductor research, microelectronics, protective coatings, and advanced optical devices where high temperature resistance and stable electrical performance are required.

Detailed Description

Niobium silicide targets are generally produced by powder metallurgy techniques such as hot pressing or hot isostatic pressing (HIP) to achieve high density and homogeneity. With a typical composition of Niobium Disilicide (NbSi₂), the target exhibits strong covalent bonding, leading to excellent hardness, oxidation resistance, and thermal conductivity.

Key features include:

  • High Purity (≥99.9%): Ensures clean thin films with minimal contamination.

  • Strong Oxidation Resistance: Stable in high-temperature and oxidative environments.

  • Mechanical Hardness: Produces durable films suitable for protective and wear-resistant coatings.

  • Electronic Properties: Suitable for microelectronic and semiconductor device fabrication.

  • Tailored Geometry: Available in planar and rotary forms, with bonding options for better thermal management.

Applications

Niobium Silicide Sputtering Targets are used across multiple advanced industries:

  • Semiconductors: Deposition of thin films for transistors, integrated circuits, and diffusion barriers.

  • Microelectronics: Metallization layers and functional coatings for devices.

  • Protective & Decorative Coatings: Hard coatings for cutting tools, optical instruments, and wear-resistant surfaces.

  • Energy & Photonics: Thin films for sensors, optical coatings, and high-temperature components.

  • R&D and Universities: Thin film studies in materials science, superconductivity, and nanotechnology.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity ensures thin film reliability
CompositionNbSi₂Provides balance of hardness and oxidation resistance
Diameter25 – 300 mm (customizable)Matches sputtering system requirements
Thickness3 – 6 mmInfluences deposition rate
BondingCopper / Titanium backingImproves heat dissipation and target stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Niobium Silicide (NbSi₂)High-temperature stability & hardnessSemiconductor coatings, wear protection
Pure Niobium (Nb)Excellent ductility & conductivitySuperconductors, electronics
Silicon (Si)Semiconductor propertiesIntegrated circuits, photonics

FAQ

QuestionAnswer
Can the target size be customized?Yes, both planar and rotary targets can be tailored to specific system dimensions.
What bonding options are available?Copper or titanium backing plates are commonly used for thermal management.
What is the delivery time?Typically 3–4 weeks depending on order size and customization.
How is it packaged?Targets are vacuum-sealed with protective foam and shipped in export-safe crates.
Which industries use it most?Semiconductor, optics, energy, microelectronics, and R&D institutions.

Packaging

Each Niobium Silicide Sputtering Target is securely vacuum-packed or argon-protected to prevent contamination. External labeling includes purity, dimensions, lot number, and composition to ensure traceability and quality control. Packaging is reinforced to withstand long-distance transport.

Conclusion

The Niobium Silicide Sputtering Target delivers a reliable solution for thin film deposition where high-temperature performance, oxidation resistance, and mechanical durability are essential. Its versatility across semiconductors, optics, and protective coatings makes it a valuable material for advanced research and industrial applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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NbSi2 target 2N5 ø76.2×6.35mm Suggested with Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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