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ST0265 Niobium Silicide Sputtering Target, NbSi2

Chemical Formula: NbSi2
Catalog Number: ST0265
CAS Number: 12060-34-3
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Niobium Silicide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Niobium Silicide Sputtering Target Description

The niobium silicide sputtering target is a type of silicide ceramic sputtering target composed of niobium and silicon.

Niobium

niobium

  • Origin: The name niobium is derived from Niobe, the daughter of King Tantalus in Greek mythology.
  • First Mentioned: 1801
  • Discovered By: C. Hatchett
  • Isolation Announced By: W. Blomstrand
  • Chemical Symbol: Nb
  • Atomic Number: 41
  • Location: Period 5, Group 5, d-block
  • Relative Atomic Mass: 92.906 38(2) Dalton (the number in brackets indicates the uncertainty)

Related Product: Niobium Sputtering Target

Silicon

Silicon

  • Origin: The name silicon is derived from the Latin word silex or silicis, meaning flint.
  • First Mentioned: 1824
  • Discovered By: J. Berzelius
  • Chemical Symbol: Si
  • Atomic Number: 14
  • Location: Period 3, Group 14, p-block
  • Relative Atomic Mass: 28.0855(3) Dalton (the number in brackets indicates the uncertainty)

Niobium Silicide Sputtering Target Application

  • Thin Film Deposition
  • Decoration
  • Semiconductor Devices
  • Display Technologies
  • LED and Photovoltaic Devices
  • Functional Coatings
  • Optical Information Storage
  • Glass Coating (including car glass and architectural glass)
  • Optical Communication

Niobium Silicide Sputtering Target Packing

Our niobium silicide sputter targets are tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

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TFM offers Niobium Silicide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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