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ST0301 Zirconium Boride Sputtering Target, ZrB2

Chemical Formula: ZrB2
Catalog Number: ST0301
CAS Number: 12045-64-6
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Zirconium Boride (ZrB₂) sputtering targets are advanced ceramic materials widely used for depositing ultra-hard, high-temperature resistant thin films. As a member of the ultra-high temperature ceramics (UHTCs) family, ZrB₂ offers exceptional thermal stability, electrical conductivity, and wear resistance, making it highly suitable for demanding applications in aerospace, electronics, and protective coatings.

Detailed Description

ZrB₂ sputtering targets are typically manufactured using hot pressing or spark plasma sintering (SPS) to achieve high density and a refined microstructure. This ensures stable sputtering behavior, reduced particle generation, and consistent thin film quality during deposition.

Unlike many ceramics, ZrB₂ exhibits good electrical conductivity, enabling the use of DC magnetron sputtering systems in addition to RF sputtering. Its extremely high melting point (~3245°C) and strong covalent bonding structure provide outstanding resistance to thermal shock, oxidation (when properly protected), and mechanical wear.

The deposited ZrB₂ thin films are known for their hardness, chemical inertness, and high-temperature performance. These films can serve as protective coatings in harsh environments, as well as functional layers in microelectronics and optical systems. For high-power or large-area sputtering, targets can be bonded to copper backing plates to improve heat dissipation and extend service life.

Key features include:

  • Ultra-high temperature stability and hardness

  • Good electrical conductivity for DC sputtering compatibility

  • High density and uniform microstructure for stable deposition

  • Excellent wear and corrosion resistance

  • Suitable for both functional and protective thin film applications

Applications

ZrB₂ sputtering targets are widely used in:

  • Protective coatings for aerospace and high-temperature components

  • Wear-resistant and anti-corrosion coatings

  • Microelectronics and semiconductor devices

  • Optical coatings requiring durability

  • Cutting tools and mechanical components

  • Research on ultra-high temperature ceramic materials

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaZrB₂Defines material composition
Purity99.5% – 99.9%Ensures film performance
Density≥ 95% – 99% theoreticalStable sputtering behavior
Melting Point~3245°CHigh-temperature capability
Diameter50 – 200 mm (custom available)System compatibility
Thickness3 – 6 mmInfluences target lifetime
Electrical TypeConductiveSupports DC sputtering
BondingCu backing / In / elastomerImproves thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
ZrB₂Ultra-high temperature & hardnessAerospace coatings
TiB₂High hardness, lower costWear-resistant coatings
ZrCExcellent thermal resistanceHigh-temp applications
HfB₂Superior oxidation resistanceExtreme environments

FAQ

QuestionAnswer
Can ZrB₂ be sputtered using DC power?Yes, due to its electrical conductivity, DC magnetron sputtering is suitable.
Is bonding recommended?For high-power applications, copper backing plates are recommended.
What are the main advantages of ZrB₂ coatings?High hardness, thermal stability, and chemical resistance.
Can sizes and shapes be customized?Yes, targets can be tailored to specific system requirements.
Which industries use ZrB₂ most?Aerospace, semiconductor, and advanced coatings industries.

Packaging

Our Zirconium Boride Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Zirconium Boride (ZrB₂) sputtering targets offer exceptional performance for high-temperature and wear-resistant thin film applications. With their unique combination of hardness, conductivity, and thermal stability, they are an excellent choice for advanced industrial and research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Target Bonding of Zirconium Boride Sputtering Target

Specialized bonding services for Zirconium Boride Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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